Global Patent Index - EP 0438971 B1

EP 0438971 B1 19940511 - Coated metallic substrate.

Title (en)

Coated metallic substrate.

Title (de)

Beschichtetes metallisches Substrat.

Title (fr)

Substrat métallique revêtu.

Publication

EP 0438971 B1 19940511 (DE)

Application

EP 90810867 A 19901112

Priority

CH 18190 A 19900122

Abstract (en)

[origin: US5230755A] A protective layer for a metal substrate is metallurgically bonded to the substrate and contains (as a percentage by mass) 35 to 50% chromium, up to 10% of which can be replaced by molybdenium, and at least iron, the proportion of iron being at least 25%. The minimum hardness is 800 HVO.1, obtained by a structure having a minimum content of 5% by volume as sigma phase. The sigma phase is obtained by heat-treatment of the coated substrate. The protective layer is particularly resistant to corrosion and also has good resistance to erosion and wear.

IPC 1-7

C23C 4/08; C23C 4/18; C23C 30/00; C23C 26/02

IPC 8 full level

C21D 9/00 (2006.01); C22C 27/06 (2006.01); C22C 30/00 (2006.01); C22C 38/00 (2006.01); C22C 38/22 (2006.01); C22F 1/00 (2006.01); C23C 4/08 (2016.01); C23C 4/18 (2006.01); C23C 26/00 (2006.01); C23C 26/02 (2006.01); C23C 30/00 (2006.01)

CPC (source: EP US)

C23C 4/08 (2013.01 - EP US); C23C 4/18 (2013.01 - EP US); C23C 26/02 (2013.01 - EP US); C23C 30/00 (2013.01 - EP US)

Citation (examination)

EP 0266149 A2 19880504 - HITACHI LTD [JP], et al

Designated contracting state (EPC)

AT BE CH DE ES FR GB IT LI NL

DOCDB simple family (publication)

EP 0438971 A1 19910731; EP 0438971 B1 19940511; AT E105594 T1 19940515; DE 59005683 D1 19940616; ES 2053163 T3 19940716; JP 3065674 B2 20000717; JP H04214879 A 19920805; US 5230755 A 19930727

DOCDB simple family (application)

EP 90810867 A 19901112; AT 90810867 T 19901112; DE 59005683 T 19901112; ES 90810867 T 19901112; JP 510691 A 19910121; US 64160391 A 19910115