EP 0440053 B1 19931215 - Structure of metallic plates.
Title (en)
Structure of metallic plates.
Title (de)
Metallplättchenverbund.
Title (fr)
Assemblage de plaques métalliques.
Publication
Application
Priority
DE 4002818 A 19900131
Abstract (en)
[origin: CA2034133A1] The invention relates to a metal platelet compound comprising metal platelets disposed side by side and connected by linking members. This metal platelet compound is characterized by having applied to its underside, i.e. application side, a hot melt adhesive layer which increases the stability of the metal platelet compound and simplifies its handling.
IPC 1-7
IPC 8 full level
A44C 11/00 (2006.01); A44C 17/02 (2006.01); A44C 17/04 (2006.01); A44C 27/00 (2006.01)
CPC (source: EP KR US)
A44C 11/007 (2013.01 - EP US); A44C 25/00 (2013.01 - KR); A44C 17/02 (2013.01 - EP US); A44C 17/04 (2013.01 - EP US); Y10T 29/4959 (2015.01 - EP US)
Citation (examination)
Designated contracting state (EPC)
AT BE CH DE ES FR GB IT LI LU NL SE
DOCDB simple family (publication)
EP 0440053 A1 19910807; EP 0440053 B1 19931215; AT E98451 T1 19940115; AU 630014 B2 19921015; AU 6944491 A 19910801; BR 9100388 A 19911022; CA 2034133 A1 19910801; CN 1053741 A 19910814; DE 4002818 A1 19910801; DE 4002818 C2 19920102; DE 59100700 D1 19940127; JP H04227204 A 19920817; KR 910021228 A 19911220; US 5155990 A 19921020
DOCDB simple family (application)
EP 91100619 A 19910118; AT 91100619 T 19910118; AU 6944491 A 19910117; BR 9100388 A 19910130; CA 2034133 A 19910114; CN 91100950 A 19910131; DE 4002818 A 19900131; DE 59100700 T 19910118; JP 9830991 A 19910131; KR 910001659 A 19910131; US 64519691 A 19910124