EP 0440615 A1 19910814 - USES OF UNIAXIALLY ELECTRICALLY CONDUCTIVE ARTICLES.

Title (en)

USES OF UNIAXIALLY ELECTRICALLY CONDUCTIVE ARTICLES.

Title (de)

VERWENDUNG VON UNIAXIAL LEITENDEN GEGENSTÄNDEN.

Title (fr)

EMPLOIS D'ARTICLES UNIAXIALEMENT ELECTROCONDUCTEURS.

Publication

EP 0440615 A1 19910814 (EN)

Application

EP 89902401 A 19890203

Priority

GB 8802565 A 19880205
GB 8819895 A 19880822
GB 8823053 A 19880930
GB 8828245 A 19881202

Abstract (en)

[origin: EP0329314A1] Polymer (preferably polyimide) sheets (10) with laser ablated through-holes plated with metal (20) are used for making electrical connections to specified microcircuits, especially unbumped microchips and Tape Automated Bonding (TAB) articles. Bonding with different melting-point materials at opposite ends of the plated holes is disclosed. Preferred polyimides are those derived from polymerisation of 4,4'-biphenyldianhydride and (4,4'-diaminobiphenyl, or 4,4'-diaminobiphenylether, or phenylenediamine, preferably p-phenylenediamine).

Abstract (fr)

On utilise des feuilles de polymère (10) (de préférence polyimide) pourvues de trous débouchants réalisés par ablation au laser et métallisés (20), pour fabriquer des connexions électriques destinées à des microcircuits spécifiés, notamment à des puces à sorties et des articles à transfert automatique sur bande (TAB). Est également décrite la réalisation de connexions, à l'aide de matériaux à point de fusion différent, aux extrémités opposées des trous métallisés. Les polyimides préférés sont ceux dérivés de la polymérisation de 4,4'-biphényldianhydride et de (4,4'-diaminobiphényle, ou bien 4,4'-diaminobiphényléther, ou phénylènediamine, de préférence p-phénylènediamine).

IPC 1-7

H01L 21/48; H01L 23/50

IPC 8 full level

H01L 21/60 (2006.01); B23K 1/00 (2006.01); B23K 20/02 (2006.01); B23K 31/02 (2006.01); H01L 21/48 (2006.01); H01L 23/14 (2006.01); H01L 23/373 (2006.01); H01L 23/492 (2006.01); H01L 23/498 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01); H05K 1/03 (2006.01); H05K 3/00 (2006.01)

CPC (source: EP KR)

B23K 1/0016 (2013.01 - EP); B23K 20/023 (2013.01 - EP); B23K 31/02 (2013.01 - EP); H01L 21/486 (2013.01 - EP); H01L 23/145 (2013.01 - EP); H01L 23/3733 (2013.01 - EP); H01L 23/4922 (2013.01 - EP); H01L 23/49827 (2013.01 - EP); H01L 23/4985 (2013.01 - EP); H01L 23/50 (2013.01 - KR); H01L 24/11 (2013.01 - EP); H01L 24/12 (2013.01 - EP); H01L 24/16 (2013.01 - EP); H01L 24/50 (2013.01 - EP); H01L 24/86 (2013.01 - EP); B23K 2101/40 (2018.07 - EP); H01L 24/81 (2013.01 - EP); H01L 2224/05624 (2013.01 - EP); H01L 2224/1012 (2013.01 - EP); H01L 2224/11334 (2013.01 - EP); H01L 2224/13099 (2013.01 - EP); H01L 2224/16238 (2013.01 - EP); H01L 2224/81101 (2013.01 - EP); H01L 2224/81801 (2013.01 - EP); H01L 2924/00013 (2013.01 - EP); H01L 2924/01005 (2013.01 - EP); H01L 2924/01006 (2013.01 - EP); H01L 2924/01013 (2013.01 - EP); H01L 2924/01015 (2013.01 - EP); H01L 2924/01023 (2013.01 - EP); H01L 2924/01027 (2013.01 - EP); H01L 2924/01029 (2013.01 - EP); H01L 2924/01033 (2013.01 - EP); H01L 2924/01043 (2013.01 - EP); H01L 2924/01046 (2013.01 - EP); H01L 2924/01047 (2013.01 - EP); H01L 2924/01049 (2013.01 - EP); H01L 2924/01074 (2013.01 - EP); H01L 2924/01078 (2013.01 - EP); H01L 2924/01079 (2013.01 - EP); H01L 2924/01082 (2013.01 - EP); H01L 2924/014 (2013.01 - EP); H01L 2924/10253 (2013.01 - EP); H01L 2924/12042 (2013.01 - EP); H01L 2924/14 (2013.01 - EP); H01L 2924/15173 (2013.01 - EP); H05K 1/0326 (2013.01 - EP); H05K 1/0333 (2013.01 - EP); H05K 1/0346 (2013.01 - EP); H05K 1/036 (2013.01 - EP); H05K 3/0017 (2013.01 - EP); H05K 3/0032 (2013.01 - EP); H05K 2201/0116 (2013.01 - EP); H05K 2201/0154 (2013.01 - EP); H05K 2201/10378 (2013.01 - EP); H05K 2203/107 (2013.01 - EP)

C-Set (source: EP)

Citation (search report)

See references of WO 8907339A1

Designated contracting state (EPC)

AT BE CH DE FR GB IT LI NL SE

DOCDB simple family (publication)

EP 0329314 A1 19890823; CA 1321659 C 19930824; EP 0440615 A1 19910814; JP 2758053 B2 19980525; JP H03502511 A 19910606; KR 900701042 A 19900817; WO 8907339 A1 19890810

DOCDB simple family (application)

EP 89301107 A 19890203; CA 590179 A 19890206; EP 89902401 A 19890203; GB 8900111 W 19890203; JP 50220489 A 19890203; KR 890701828 A 19891005