Global Patent Index - EP 0446934 B1

EP 0446934 B1 19980923 - Method of fabricating a composite material

Title (en)

Method of fabricating a composite material

Title (de)

Verfahren zur Herstellung von Kompositmaterial

Title (fr)

Procédé pour fabriquer un matériau composite

Publication

EP 0446934 B1 19980923 (EN)

Application

EP 91103974 A 19910314

Priority

  • JP 5954591 A 19910228
  • JP 6519790 A 19900315

Abstract (en)

[origin: EP0446934A2] In order to obtain a composite material excellent in the bonding strength (adhesion) of two materials and thermal conductivity, the invention presents a fabricating method of a composite material by compounding a high melting material W and a low melting material Cu, which comprises, a first step (1, 2, 3) of forming pores in the high melting material W, having the porosity distribution so that the porosity may be large at least in part of the surface thereof and that the porosity may gradually increase toward that part, and a second step (4) of infiltrating the low melting material Cu from the large porosity part of the material obtained in the first step (1, 2, 3), wherein the composition ratio of the high melting material and low melting material is in a gradient distribution. <IMAGE>

IPC 1-7

B22F 3/26; B22F 3/10; F28F 13/00

IPC 8 full level

B22F 3/26 (2006.01); C22C 1/04 (2006.01); C23C 4/02 (2006.01); C23C 4/12 (2006.01); C23C 4/18 (2006.01); F28F 13/00 (2006.01)

CPC (source: EP KR)

B22F 3/26 (2013.01 - EP); C22C 1/00 (2013.01 - KR); C22C 9/00 (2013.01 - EP); C23C 4/02 (2013.01 - EP); C23C 4/18 (2013.01 - EP); F28F 13/00 (2013.01 - EP); B22F 2998/00 (2013.01 - EP); B22F 2998/10 (2013.01 - EP); B22F 2999/00 (2013.01 - EP); F28F 2255/18 (2013.01 - EP)

Designated contracting state (EPC)

DE FR GB

DOCDB simple family (publication)

EP 0446934 A2 19910918; EP 0446934 A3 19930630; EP 0446934 B1 19980923; DE 69130237 D1 19981029; DE 69130237 T2 19990325; JP 2950436 B2 19990920; JP H04214826 A 19920805; KR 910016950 A 19911105; KR 940008937 B1 19940928

DOCDB simple family (application)

EP 91103974 A 19910314; DE 69130237 T 19910314; JP 5954591 A 19910228; KR 910004112 A 19910315