EP 0448999 A3 19920506 - PROCESS AND DEVICE FOR MANUFACTURING LACQUED WIRES WITH MOLTED RESINS
Title (en)
PROCESS AND DEVICE FOR MANUFACTURING LACQUED WIRES WITH MOLTED RESINS
Publication
Application
Priority
DE 4010306 A 19900330
Abstract (en)
[origin: EP0448999A2] For manufacturing lacquered wires with virtually solvent-free molten resins, as far as the process is concerned, the bare wire is prepared for coating in a way dependent on the material, a supply of resin for the coating is melted and kept by the application of heat at a temperature to obtain suitable viscosity for coating, the molten resin is pumped along under positive pressure against the direction of movement of the wire over a predetermined length of the said wire, over its entire circumference, parts of the resin coating the wire, whereas the excess resin and the resin coating the wire and then calibrated to a predetermined circumferential size is returned to the supply. The resin coating the wire is subsequently cured. As far as the device is concerned, a coating device comprises a wire preparing device, in particular for the wire to be cleaned, heated and the like for its material-dependent preparation, a resin preparation device, a resin application device, the resin preparation device and resin application device being arranged in the form of a closed circuit, as well as a stoving oven. <IMAGE>
IPC 1-7
IPC 8 full level
B05C 3/12 (2006.01); H01B 7/02 (2006.01); H01B 13/00 (2006.01); H01B 13/06 (2006.01); H01B 13/16 (2006.01)
CPC (source: EP US)
H01B 13/065 (2013.01 - EP US)
Citation (search report)
- [X] EP 0009312 A1 19800402 - PHELPS DODGE IND INC [US]
- [X] AT 318037 B 19740925 - M A G MASCHINEN UND APPBAU FUC
- [A] US 4258646 A 19810331 - KLOCZEWSKI HAROLD A, et al
- [A] FR 2088681 A5 19720107 - BECK & CO AG
- [A] FR 2101206 A1 19720331 - BECK & CO AG
Designated contracting state (EPC)
DE ES GB IT
DOCDB simple family (publication)
EP 0448999 A2 19911002; EP 0448999 A3 19920506; EP 0448999 B1 19950802; DE 4010306 A1 19911002; DE 4010306 C2 19990610; DE 59106107 D1 19950907; ES 2076388 T3 19951101; JP 2960184 B2 19991006; JP H07114844 A 19950502; US 5492721 A 19960220
DOCDB simple family (application)
EP 91103406 A 19910306; DE 4010306 A 19900330; DE 59106107 T 19910306; ES 91103406 T 19910306; JP 6512891 A 19910329; US 7405393 A 19930608