Global Patent Index - EP 0455615 B1

EP 0455615 B1 19940817 - Mailer form and process.

Title (en)

Mailer form and process.

Title (de)

Versandbrief und Verfahren zu seiner Herstellung.

Title (fr)

Pli postal et procédé pour sa fabrication.

Publication

EP 0455615 B1 19940817 (EN)

Application

EP 91850095 A 19910417

Priority

SE 9001492 A 19900425

Abstract (en)

[origin: EP0455615A1] A mailer form or similar made from paper and intended to be sealed by means of adhesive applied thereupon, the characterizing features thereof being that it is provided with adhesive strips comprising a first pressure sensitive adhesive layer applied onto the paper and a second moisture sensitive adhesive layer applied on top thereof. Preferably the pressure sensitive adhesive is a natural rubber-based adhesive, while the moisture sensitive adhesive is preferably an ethylene-vinylacetate copolymer-based adhesive. A process for the manufacture of the above-mentioned form, which comprises firstly coating the paper with a layer of the pressure sensitive adhesive and then applying the moisture sensitive adhesive on top thereof. Preferably the two adhesives are aqueous based and preferably they are dried by means of a radio frequency drying operation.

IPC 1-7

B42D 5/02

IPC 8 full level

B42D 5/02 (2006.01)

CPC (source: EP)

B42D 5/025 (2013.01)

Designated contracting state (EPC)

AT BE CH DE DK ES FR GB GR IT LI LU NL SE

DOCDB simple family (publication)

EP 0455615 A1 19911106; EP 0455615 B1 19940817; AT E110032 T1 19940915; DE 69103466 D1 19940922; FI 911989 A0 19910424; FI 911989 A 19911026; NO 911633 D0 19910424; NO 911633 L 19911028; SE 9001492 D0 19900425; SE 9001492 L 19911026

DOCDB simple family (application)

EP 91850095 A 19910417; AT 91850095 T 19910417; DE 69103466 T 19910417; FI 911989 A 19910424; NO 911633 A 19910424; SE 9001492 A 19900425