Global Patent Index - EP 0462586 A3

EP 0462586 A3 19930113 - WOODY BOARD

Title (en)

WOODY BOARD

Publication

EP 0462586 A3 19930113 (EN)

Application

EP 91110039 A 19910619

Priority

JP 16039990 A 19900619

Abstract (en)

[origin: EP0462586A2] Disclosed is a woody board, in which a molded layer of a woody material of a wood powder or woody fibers is provided on one surface or both surfaces of a woody substrate of a molded sheet of a coniferous tree plywood or coniferous tree LVL, and a method of preparing said woody board. The woody board is prepared by molding a woody material mix comprising an adhesive and a woody material of a wood powder or woody fibers on at least one surface of a woody substrate. The woody board has a flat and smooth surface and has a high mechanical strength and a high screw-drawing resistance.

IPC 1-7

B27N 3/06; B27D 1/00

IPC 8 full level

B27D 1/00 (2006.01); B27N 3/00 (2006.01); B27N 3/06 (2006.01)

CPC (source: EP KR)

B27D 1/00 (2013.01 - EP); B27N 3/02 (2013.01 - KR); B27N 3/06 (2013.01 - EP)

Citation (search report)

Designated contracting state (EPC)

DE FR GB IT SE

DOCDB simple family (publication)

EP 0462586 A2 19911227; EP 0462586 A3 19930113; EP 0462586 B1 19990825; AU 653529 B2 19941006; AU 7914991 A 19920102; CA 2044865 A1 19911220; CA 2044865 C 20000314; DE 69131547 D1 19990930; DE 69131547 T2 20000113; JP 3038488 B2 20000508; JP H0452102 A 19920220; KR 0183985 B1 19990401; KR 920000447 A 19920129; NZ 238616 A 19940726

DOCDB simple family (application)

EP 91110039 A 19910619; AU 7914991 A 19910619; CA 2044865 A 19910618; DE 69131547 T 19910619; JP 16039990 A 19900619; KR 910009849 A 19910614; NZ 23861691 A 19910619