EP 0469988 B1 19980128 - Interconnection method between an integrated circuit and a circuit carrier and integrated circuit adapted to this method
Title (en)
Interconnection method between an integrated circuit and a circuit carrier and integrated circuit adapted to this method
Title (de)
Verbindungsverfahren zwischen einer integrierten Schaltung und einem Schaltungsträger und an dieses Verfahren angepasste, integrierte Schaltung
Title (fr)
Procédé d'interconnexion entre un circuit intégré et un circuit support et circuit intégré adapté à ce procédé
Publication
Application
Priority
FR 9009968 A 19900803
Abstract (en)
[origin: FR2665574A1] The invention relates to a method for interconnection of an integrated circuit on a support, replacing connecting wires. According to the invention, an integrated circuit chip (1) is fixed on a support (4) by soldering the metallisations of the earth plane (18, 20). However, the input/output lands (7, 13) of the integrated circuit are joined to the metallised tracks (8, 9) of the support (4) by means of metallised holes (14, 15). Application to UHF circuits. <IMAGE>
IPC 1-7
IPC 8 full level
H01L 23/48 (2006.01); H01L 23/66 (2006.01)
CPC (source: EP US)
H01L 23/481 (2013.01 - EP US); H01L 23/66 (2013.01 - EP US); H01L 24/73 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 24/49 (2013.01 - EP US); H01L 2224/05554 (2013.01 - EP US); H01L 2224/16 (2013.01 - EP US); H01L 2224/45014 (2013.01 - EP US); H01L 2224/451 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48227 (2013.01 - EP US); H01L 2224/49171 (2013.01 - EP US); H01L 2224/73265 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01014 (2013.01 - EP US); H01L 2924/01023 (2013.01 - EP US); H01L 2924/01032 (2013.01 - EP US); H01L 2924/01058 (2013.01 - EP US); H01L 2924/01072 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US); H01L 2924/15173 (2013.01 - EP US); H01L 2924/30107 (2013.01 - EP US)
Designated contracting state (EPC)
DE GB NL
DOCDB simple family (publication)
FR 2665574 A1 19920207; FR 2665574 B1 19970530; DE 69128818 D1 19980305; DE 69128818 T2 19980604; EP 0469988 A1 19920205; EP 0469988 B1 19980128; US 5158911 A 19921027
DOCDB simple family (application)
FR 9009968 A 19900803; DE 69128818 T 19910730; EP 91402129 A 19910730; US 73469491 A 19910723