Global Patent Index - EP 0470210 A1

EP 0470210 A1 19920212 - LOW INDUCTANCE ENCAPSULATED PACKAGE INCLUDING A SEMICONDUCTOR CHIP.

Title (en)

LOW INDUCTANCE ENCAPSULATED PACKAGE INCLUDING A SEMICONDUCTOR CHIP.

Title (de)

VERKAPSELTE PACKUNG NIEDRIGER INDUKTANZ MIT EINEM HALBLEITERCHIP.

Title (fr)

MODULE ENCAPSULE A FAIBLE INDUCTANCE COMPRENANT UNE PUCE A SEMI-CONDUCTEUR.

Publication

EP 0470210 A1 19920212 (EN)

Application

EP 90917818 A 19900612

Priority

US 37564089 A 19890703

Abstract (en)

[origin: WO9100617A1] A non-hermetic encapsulated semiconductor device package (90) includes wide flat leads (46b, 48b) bonded to the upper surface contact pads (16, 18) of the device. These leads are preferably solderless bonded to these contact pads.

Abstract (fr)

Un module (90) à dispositif semi-conducteur encapsulé non hermétique comprend des sorties plates et larges (46b, 48b) liées aux pastilles de contact (16, 18) de la surface supérieure du dispositif. Ces sorties sont de préférence liées sans brasage à ces pastilles de contact.

IPC 1-7

H01L 23/31; H01L 23/485; H01L 23/495

IPC 8 full level

H01L 21/60 (2006.01); H01L 23/48 (2006.01); H01L 23/485 (2006.01)

CPC (source: EP)

H01L 24/13 (2013.01); H01L 24/81 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05171 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/0616 (2013.01); H01L 2224/13 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45144 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01024 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01327 (2013.01); H01L 2924/014 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/14 (2013.01); H01L 2924/18301 (2013.01); H01L 2924/30107 (2013.01)

Citation (search report)

See references of WO 9100617A1

Designated contracting state (EPC)

DE FR GB IT

DOCDB simple family (publication)

WO 9100617 A1 19910110; EP 0470210 A1 19920212; JP H04503283 A 19920611

DOCDB simple family (application)

US 9003330 W 19900612; EP 90917818 A 19900612; JP 50955190 A 19900612