EP 0470740 B1 19950111 - Rigid-flexible printed circuit and process of forming such a circuit.
Title (en)
Rigid-flexible printed circuit and process of forming such a circuit.
Title (de)
Starr-flexible Leiterplatte und Verfahren zur Bildung derselben.
Title (fr)
Plaquette à circuit imprimé et méthode pour la formation de celle-ci.
Publication
Application
Priority
US 56543790 A 19900809
Abstract (en)
[origin: EP0470740A2] In a process for manufacturing a rigid-flexible printed circuit (40) wherein a rigid insulating layer (42) supports one portion of the printed circuit and a flexible insulator (44,45) supports another portion thereof to furnish flexible leads for connection the printed circuit to an operative device, a first assembly is provided comprising a curable prepreg insulator layer (100,100 min ) having an opening (102) for the flexible leads. A flexible sheet (104,104 min ) spans the opening, and the assembly is pressed with one surface in contact with a smooth hard surface (112) while the other surface is supported against a flowable durable prepreg layer (108). Between the insulator and flowable layers is a release layer (110,110 min ) which prevents bonding between the prepreg layers throughout most of the areas while permitting bonding along the edges. The assembly is maintained under heat and pressure to partially cure both prepreg layers and bond the flexible sheet to the edges of the opening and bond the edges of the prepregs together to form a flat rigid sandwich. A sheet of copper (116) is bonded to that surface previously in contact with the hard surface, in a second pressing operation, the copper being bonded to both the partially cured prepreg layer and the flexible sheet, and thereafter the bonded edges of the cured prepreg layers, are severed to permit separation of the cured prepreg layers.
IPC 1-7
IPC 8 full level
H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01); H05K 3/06 (2006.01)
CPC (source: EP US)
H05K 3/4691 (2013.01 - EP US); H05K 3/06 (2013.01 - EP US); H05K 2201/0187 (2013.01 - EP US); H05K 2201/0355 (2013.01 - EP US); H05K 2203/1536 (2013.01 - EP US); H05K 2203/308 (2013.01 - EP US); Y10T 29/49155 (2015.01 - EP US)
Designated contracting state (EPC)
AT BE CH DE DK ES FR GB GR IT LI LU NL SE
DOCDB simple family (publication)
EP 0470740 A2 19920212; EP 0470740 A3 19921230; EP 0470740 B1 19950111; AT E117160 T1 19950115; DE 69106624 D1 19950223; DE 69106624 T2 19950810; DK 0470740 T3 19950619; ES 2066360 T3 19950301; GR 3015668 T3 19950731; JP 2832868 B2 19981209; JP H06342980 A 19941213; US 5095628 A 19920317
DOCDB simple family (application)
EP 91306862 A 19910726; AT 91306862 T 19910726; DE 69106624 T 19910726; DK 91306862 T 19910726; ES 91306862 T 19910726; GR 950400812 T 19950403; JP 10657091 A 19910412; US 56543790 A 19900809