EP 0472590 A4 19920527 - SYSTEM AND METHOD FOR MONITORING PRESSURE DURING THE PRODUCTION OF FIBER REINFORCED POLYMERS
Title (en)
SYSTEM AND METHOD FOR MONITORING PRESSURE DURING THE PRODUCTION OF FIBER REINFORCED POLYMERS
Publication
Application
Priority
US 34882289 A 19890508
Abstract (en)
[origin: WO9013425A1] Disclosed is a system and method of monitoring exerted pressure during the production of composite material laminates that utilizes a thin, low cost, durable, temperature resistant force sensing resistor (50). The sensor (50) can be embedded directly on the surface of the composite laminate (42), or can be positioned between layers of the composite laminate (42). Alternatively, the sensor (50) is built into or mounted on a tool (46) or die used to form or exert pressure on the laminate (42). In all of these cases, the force sensing resistor (50) monitors the pressure experienced by the laminate (42) during processing of the laminate (42).
IPC 1-7
IPC 8 full level
B29C 43/20 (2006.01); B29C 43/56 (2006.01); B29C 43/58 (2006.01); B29C 70/06 (2006.01); B29C 70/34 (2006.01); B29C 70/54 (2006.01); B32B 37/10 (2006.01); G01L 5/00 (2006.01); B29K 105/06 (2006.01)
CPC (source: EP US)
B29C 43/203 (2013.01 - EP); B29C 43/56 (2013.01 - EP); B29C 43/58 (2013.01 - EP); B29C 70/342 (2013.01 - EP); B29C 70/54 (2013.01 - EP US); B32B 37/10 (2013.01 - EP); G01L 5/008 (2013.01 - EP US); B29C 2043/5808 (2013.01 - EP); B32B 41/00 (2013.01 - EP); B32B 2309/12 (2013.01 - EP)
Citation (search report)
- [XO] SIXTH INTERNATIONAL ELECTRONIC MANUFACTURING TECHNOLOGY SYMPOSIUM, Nara, 26th - 28th April 1989 & IEEE TRANSACTIONS ON COMPONENTS, HYBRIDS, AND MANUFACTURING TECHNOLOGY, vol. 13, no. 2, June 1990, pages 435-439; Y. HATAMURA et al.: "Analysis of the dynamic phenomena during lamination of multilayer printed circuit board by the measurement of pressure distribution"
- See references of WO 9013425A1
Designated contracting state (EPC)
AT BE CH DE DK ES FR GB IT LI LU NL SE
DOCDB simple family (publication)
WO 9013425 A1 19901115; CA 2055436 A1 19901109; EP 0472590 A1 19920304; EP 0472590 A4 19920527; JP H04505135 A 19920910
DOCDB simple family (application)
US 9002489 W 19900504; CA 2055436 A 19900504; EP 90907685 A 19900504; JP 50781590 A 19900504