Global Patent Index - EP 0473641 A4

EP 0473641 A4 19920708 - METHOD OF BONDING WITH WATER-BASED ADHESIVES

Title (en)

METHOD OF BONDING WITH WATER-BASED ADHESIVES

Publication

EP 0473641 A4 19920708 (EN)

Application

EP 90907626 A 19900416

Priority

US 35544189 A 19890522

Abstract (en)

[origin: WO9014223A1] A method of bonding in which water-based adhesives, i.e., aqueous polymeric dispersions or emulsions, are extruded from the discharge outlet (26) of a dispensing device (10) as a bead (12) which is impinged by air jets (14) directed at an angle and tangent to the periphery of the bead. The viscosity of the water-based adhesive, hydraulic pressure at which the adhesive is extruded from the dispensing device, diameter of the discharge outlet and pressure of the air jets are controlled such that the extruded bead is attenuated by the air jets to form an elongated, thin adhesive strand or fiber (16) which is deposited in a spiral pattern (31) on a first substrate (32) for subsequent bonding to a second substrate.

IPC 1-7

B32B 7/14

IPC 8 full level

B05C 5/00 (2006.01); B05B 7/08 (2006.01); B05C 5/02 (2006.01); B05D 1/26 (2006.01); B05D 5/10 (2006.01); C09J 5/00 (2006.01)

CPC (source: EP KR)

B05B 7/0861 (2013.01 - EP); B05C 5/02 (2013.01 - EP); B05D 1/26 (2013.01 - EP); B05D 3/042 (2013.01 - EP); B32B 7/14 (2013.01 - KR)

Citation (search report)

  • No further relevant documents disclosed
  • See references of WO 9014223A1

Designated contracting state (EPC)

BE CH DE DK ES FR GB IT LI SE

DOCDB simple family (publication)

WO 9014223 A1 19901129; AU 5637490 A 19901218; CA 2051634 A1 19901123; EP 0473641 A1 19920311; EP 0473641 A4 19920708; JP H04505338 A 19920917; KR 920700907 A 19920810

DOCDB simple family (application)

US 9002048 W 19900416; AU 5637490 A 19900416; CA 2051634 A 19900416; EP 90907626 A 19900416; JP 50748590 A 19900416; KR 910701651 A 19911121