EP 0476876 A3 19920729 - PROCESS FOR NON-DESTRUCTIVE HEAT TREATMENT OF SPOOLED SILVER COATED HIGH TEMPERATURE SUPERCONDUCTOR

Title (en)

PROCESS FOR NON-DESTRUCTIVE HEAT TREATMENT OF SPOOLED SILVER COATED HIGH TEMPERATURE SUPERCONDUCTOR

Publication

EP 0476876 A3 19920729 (EN)

Application

EP 91308005 A 19910830

Priority

US 58641490 A 19900921

Abstract (en)

[origin: EP0476876A2] A method for heat processing a superconductor wire (11) which has a protective silver cladding (26) includes the steps of attaching the coated wire (12) to a spool (60) and then rotating the spool (60) to wind the wire (12) around the spool (60) in juxtaposed coils (70). As the wire (12) is being wound around the spool (60), the portions of the wire (11) which are not yet coiled are drawn through a container (34) which holds a paint (38) that contains a silver diffusion inhibiting material. The diffusion inhibiting material is consequently deposited onto the silver cladding (26) of the superconductor wire (11), and the coiled wire (12) is subsequently placed in a furnace (74). The wire (12) is heat processed in the furnace (74) as appropriate for the particular type of superconductor material. The diffusion inhibitor material prevents diffusion of silver during the heat processing between portions of the wire (12) which contact each other. <IMAGE>

IPC 1-7

H01L 39/14; H01L 39/24

IPC 8 full level

C01B 13/14 (2006.01); C01G 1/00 (2006.01); C01G 3/00 (2006.01); H01B 12/06 (2006.01); H01B 13/00 (2006.01); H01L 39/24 (2006.01)

CPC (source: EP US)

H10N 60/0801 (2023.02 - EP US); Y10S 505/704 (2013.01 - EP US)

Citation (search report)

[X] EP 0285319 A2 19881005 - AMERICAN TELEPHONE & TELEGRAPH [US]
[X] EP 0301283 A1 19890201 - ASEA BROWN BOVERI [CH]
[A] AT 388393 B 19890612 - PLANSEE METALLWERK [AT]
[AP] EP 0392661 A2 19901017 - GEN ATOMICS [US]

Designated contracting state (EPC)

AT BE DE FR GB IT NL SE

DOCDB simple family (publication)

EP 0476876 A2 19920325; EP 0476876 A3 19920729; CA 2049553 A1 19920322; CA 2049553 C 20000516; JP 2865460 B2 19990308; JP H04274115 A 19920930; US 5140006 A 19920818

DOCDB simple family (application)

EP 91308005 A 19910830; CA 2049553 A 19910820; JP 24082991 A 19910920; US 58641490 A 19900921