EP 0478709 A1 19920408 - DEVICE FOR FORMING A SOLDER CONNECTION.
Title (en)
DEVICE FOR FORMING A SOLDER CONNECTION.
Title (de)
VORRICHTUNG ZUR HERSTELLUNG EINER LÖTVERBINDUNG.
Title (fr)
DISPOSITIF SERVANT A FORMER DES BRASURES.
Publication
Application
Priority
US 36875689 A 19890620
Abstract (en)
[origin: US4940179A] A device for connecting two bodies such as wires, and for sealing the connection between them, comprising a heat-shrinkable sleeve, a solder insert and an annular composite adhesive insert which comprises two layers of heat-activatable adhesive material. The viscosity of the radially inner layer is less than that of the outer layer. The device is heated to cause the sleeve to shrink and to cause the solder to fuse to form a connection between the bodies. Flow of the inner, less viscous layer of the adhesive insert is restricted by the outer viscous layer, to minimize contamination of the solder by the material of the inner layer.
Abstract (fr)
Un dispositif servant à relier deux corps tels que des fils métalliques, et à sceller la connexion entre eux, comportant une gaine thermorétrécissable, une garniture de brasage et une garniture annulaire en adhésif mixte qui comprend deux couches de matériau adhésif thermoactivable. La viscosité de la couche radiale interne est inférieure à celle de la couche externe. Le dispositif est chauffé de sorte que la gaine rétrécisse et que la garniture de brasage fonde afin de former une connexion entre les corps. L'écoulement de la couche interne et moins visqueuse de la garniture adhésive est limité par la couche visqueuse externe afin de minimaliser la contamination de la garniture de brasage par le matériau de la couche interne.
IPC 1-7
IPC 8 full level
C09J 7/02 (2006.01); B29C 61/06 (2006.01); H01R 4/02 (2006.01); H01R 4/72 (2006.01)
CPC (source: EP US)
B29C 61/0616 (2013.01 - EP US); H01R 4/723 (2013.01 - EP US); H01R 4/02 (2013.01 - EP US); Y10S 174/08 (2013.01 - EP US)
Designated contracting state (EPC)
AT BE CH DE DK ES FR GB IT LI NL SE
DOCDB simple family (publication)
US 4940179 A 19900710; EP 0478709 A1 19920408; JP H05501173 A 19930304; WO 9016092 A1 19901227
DOCDB simple family (application)
US 36875689 A 19890620; EP 90917771 A 19900615; JP 50956990 A 19900615; US 9003418 W 19900615