Global Patent Index - EP 0480922 B1

EP 0480922 B1 19940105 - PROCESS FOR PRODUCING A CuCr CONTACT MATERIAL FOR VACUUM SWTICHES.

Title (en)

PROCESS FOR PRODUCING A CuCr CONTACT MATERIAL FOR VACUUM SWTICHES.

Title (de)

VERFAHREN ZUM HERSTELLEN VON CuCr-KONTAKTSTÜCKEN FÜR VAKUUMSCHALTER.

Title (fr)

PROCEDE DE FABRICATION DE CONTACTS AU CuCr POUR DES INTERRUPTEURS A VIDE.

Publication

EP 0480922 B1 19940105 (DE)

Application

EP 89906021 A 19890531

Priority

DE 8900343 W 19890531

Abstract (en)

[origin: WO9015424A1] Purely powder-metallurgical or sinter impregnation processes are often used to manufacture CuCr contact materials. Here the aim is to obtain the lowest possible residual porosity, which should be < 1 %. According to the invention, a powder moulding of the components is densified in two stages; the first stage is a sintering process with a densification of the sintered body to a closed porosity and the second stage is a hot isostatic pressing process (HIP) in which the unencased workpieces are taken to a final density amounting to a space occupation of at least 99 %. Thus an economical method of manufacturing high-grade material is obtained. It is possible in particular to produce multi-layer contacts or self-adhesive bonds between the sintered body and a solid substrate, e.g. a copper contact bolt.

IPC 1-7

H01H 1/02; H01H 11/04; B22F 3/14

IPC 8 full level

B22F 3/14 (2006.01); B22F 3/11 (2006.01); B22F 3/15 (2006.01); B22F 5/00 (2006.01); B22F 5/10 (2006.01); B22F 5/12 (2006.01); C22C 1/04 (2006.01); H01H 1/02 (2006.01); H01H 11/04 (2006.01); H01H 33/66 (2006.01)

CPC (source: EP KR US)

B22F 3/15 (2013.01 - EP KR US); C22C 1/0425 (2013.01 - EP KR US); H01H 1/0203 (2013.01 - EP US); H01H 1/0206 (2013.01 - EP KR US); H01H 11/048 (2013.01 - EP KR US)

Citation (examination)

DE 3729093 C1 19881201 - GRESSEL AG

Designated contracting state (EPC)

CH DE FR GB IT LI NL SE

DOCDB simple family (publication)

WO 9015424 A1 19901213; EP 0480922 A1 19920422; EP 0480922 B1 19940105; JP H04505985 A 19921015; KR 920702002 A 19920812; US 5330702 A 19940719

DOCDB simple family (application)

DE 8900343 W 19890531; EP 89906021 A 19890531; JP 50538989 A 19890531; KR 910700006 A 19910104; US 77740891 A 19911202