EP 0485839 B1 19950104 - Primer for metallization.
Title (en)
Primer for metallization.
Title (de)
Primer zum Metallisieren von Substratoberflächen.
Title (fr)
Couche de base pour métallisation.
Publication
Application
Priority
DE 4036591 A 19901116
Abstract (en)
[origin: EP0485839A2] Primers consisting essentially of a film-former or matrix-former, an additive, an ionogenic and/or colloidal noble metal, a filler and a solvent are suitable for coating substrate surfaces for subsequent chemical (electroless) metallisation.
IPC 1-7
IPC 8 full level
C08J 7/04 (2006.01); C09D 5/38 (2006.01); C09D 175/00 (2006.01); C09D 175/04 (2006.01); C23C 18/18 (2006.01); C23C 18/28 (2006.01); G12B 17/02 (2006.01); H05K 9/00 (2006.01)
CPC (source: EP US)
C23C 18/28 (2013.01 - EP US)
Citation (examination)
- US 3560257 A 19710202 - SCHNEBLE FREDERICK W JR, et al
- Römpps Chemie Lexikon, Band 1, 8. Auflage, 1979, Seiten 64-65
- Römpps Chemie Lexikon, Band 4, 8. Auflage, 1985, Seiten 2866-2867
Designated contracting state (EPC)
BE CH DE FR GB IT LI NL SE
DOCDB simple family (publication)
EP 0485839 A2 19920520; EP 0485839 A3 19930224; EP 0485839 B1 19950104; CA 2055352 A1 19920517; CA 2055352 C 19991026; DE 4036591 A1 19920521; DE 59104146 D1 19950216; JP H04365872 A 19921217; US 5378268 A 19950103
DOCDB simple family (application)
EP 91118731 A 19911104; CA 2055352 A 19911113; DE 4036591 A 19901116; DE 59104146 T 19911104; JP 32237691 A 19911112; US 78895791 A 19911107