EP 0499958 A2 19920826 - Process for producing thin copper foil-clad circuit board substrate.
Title (en)
Process for producing thin copper foil-clad circuit board substrate.
Title (de)
Verfahren zur Herstellung eines mit einer dünnen Kupferfolie kaschierten Substrats für Leiterplatten.
Title (fr)
Procédé de production d'un substrat pour plaques de circuit, muni d'une mince feuille de cuivre.
Publication
Application
Priority
JP 4407191 A 19910218
Abstract (en)
A process for producing a thin copper foil-clad circuit board substrate which comprises subjecting a copper foil-clad circuit board substrate (a) comprising an electrically insulating support overlaid on one or both sides with a copper foil having an average thickness of 12 mu m or more to etching with a copper-etching solution thereby to etch the whole surface of the copper foil at a predetermined etching rate selected from the range of from 0.01 to 0.4 mu m/sec, thereby to reduce the thickness of the copper foil on at least one side of the insulating support to 10 to 80 % of its original thickness with the thickness variation of the remaining etched copper foil being within +/-1.0 mu m on the basis of a desired thickness, wherein said copper foil-clad circuit board substrate (a) is one in which the surface of the copper foil is substantially free of adherent dust particles having an average particle diameter of 3 mu m or more.
IPC 1-7
IPC 8 full level
B32B 15/08 (2006.01); C23F 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/06 (2006.01); H05K 3/26 (2006.01); H05K 3/02 (2006.01)
CPC (source: EP US)
H05K 3/06 (2013.01 - EP US); H05K 3/26 (2013.01 - EP US); H05K 3/022 (2013.01 - EP US); H05K 2203/025 (2013.01 - EP US); H05K 2203/0353 (2013.01 - EP US)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 0499958 A2 19920826; EP 0499958 A3 19930407; EP 0499958 B1 19970702; DE 69220588 D1 19970807; DE 69220588 T2 19971204; JP 2985325 B2 19991129; JP H04263488 A 19920918; US 5242540 A 19930907
DOCDB simple family (application)
EP 92102319 A 19920212; DE 69220588 T 19920212; JP 4407191 A 19910218; US 83344892 A 19920206