EP 0500492 B1 19960327 - Plasma spray gun for spraying powdered or gaseous materials
Title (en)
Plasma spray gun for spraying powdered or gaseous materials
Title (de)
Plasmaspritzgerät zum Versprühen von pulverförmigem oder gasförmigem Material
Title (fr)
Appareil de pulvérisation par plasma de matériaux en poudre ou gazeux
Publication
Application
Priority
DE 4105407 A 19910221
Abstract (en)
[origin: EP0500492A1] The plasma spray gun contains an indirect plasmatron for generating a long arc, having a plasma channel (4) between the cathode arrangement (1, 20) and the anode ring (3). The cathode arrangement has a central insulation body (21) which projects into the cavity (22) of an inlet nozzle (5) of the plasma channel (4). The plasma gas is introduced into the inlet nozzle (5) through an annular channel (23) between the insulation body (21) and the nozzle wall. A plurality of rod-shaped cathodes (1) which are embedded in the insulation body (21) run parallel to one another and are arranged distributed in the circle around a central axis (2) whose active ends (63) project out of the insulation body (21) into the nozzle cavity. The spray material (SM) is supplied to the cathode-side end of the plasma channel (4) through a tube (24) which extends along the central axis (2) through the insulation body (21) and opens into the nozzle cavity, the cathode ends (20) projecting beyond the mouth (25) of the tube. By means of a high energy concentration in the nozzle cavity, energy is supplied to the spray material in this region and through the long arc along the entire plasma channel, so that the spray material emerges from the gun in the fused state with high acceleration. The anode ring has no nozzle function and can therefore be wide enough for the spray material not to impinge on it. <IMAGE>
IPC 1-7
IPC 8 full level
B05B 7/22 (2006.01); C23C 4/12 (2006.01); H05H 1/34 (2006.01); H05H 1/42 (2006.01); H05H 1/44 (2006.01)
CPC (source: EP US)
H05H 1/34 (2013.01 - EP US); H05H 1/3452 (2021.05 - EP); H05H 1/3468 (2021.05 - EP); H05H 1/3484 (2021.05 - EP); H05H 1/42 (2013.01 - EP US); H05H 1/44 (2013.01 - EP US); H05H 1/3452 (2021.05 - US); H05H 1/3468 (2021.05 - US); H05H 1/3484 (2021.05 - US)
Citation (examination)
- WO 9015516 A1 19901213 - SUENNEN JEAN [BE]
- Rutscher/Deutsch: Plasmatechnik. München, Wien 1984. Seiten 244, 262, 263.
Designated contracting state (EPC)
AT BE CH DE DK ES FR GB GR IT LI LU MC NL PT SE
DOCDB simple family (publication)
EP 0500492 A1 19920826; EP 0500492 B1 19960327; AT E136190 T1 19960415; CA 2061181 A1 19920822; CA 2061181 C 19980630; DE 4105407 A1 19920827; DE 4105407 C2 19930211; DE 59205803 D1 19960502; JP 3131001 B2 20010131; JP H0584455 A 19930406; US 5332885 A 19940726
DOCDB simple family (application)
EP 92810095 A 19920210; AT 92810095 T 19920210; CA 2061181 A 19920213; DE 4105407 A 19910221; DE 59205803 T 19920210; JP 3534792 A 19920221; US 83603792 A 19920212