Global Patent Index - EP 0502382 A1

EP 0502382 A1 19920909 - Light-sensitive composition and process.

Title (en)

Light-sensitive composition and process.

Title (de)

Lichtempfindliche Zusammensetzung und Verfahren.

Title (fr)

Composition photosensible et procédé.

Publication

EP 0502382 A1 19920909 (EN)

Application

EP 92102959 A 19920221

Priority

  • US 66360491 A 19910304
  • US 82937192 A 19920203

Abstract (en)

A photoimageable composition and process for use of the same. The composition comprises a binder that is a mixture of a phenolic resin and a multifunctional epoxy or vinyl compound and a curing system comprising a photoactive compound capable of generating a curing catalyst capable of crosslinking the binder components. The process for use of the composition comprises application of the composition to a substrate, drying of the same, exposing the dried coating to activating radiation, curing the binder in light exposed areas, developing the coating and thermally curing the developed image. The composition is especially useful as a solder mask. <IMAGE>

IPC 1-7

G03F 7/038

IPC 8 full level

C08G 59/00 (2006.01); C08G 59/18 (2006.01); C08G 59/62 (2006.01); C08L 61/04 (2006.01); C08L 61/10 (2006.01); C08L 61/20 (2006.01); C08L 61/28 (2006.01); C08L 63/00 (2006.01); G03F 7/004 (2006.01); G03F 7/029 (2006.01); G03F 7/038 (2006.01); H05K 3/28 (2006.01)

CPC (source: EP KR US)

G03F 7/038 (2013.01 - EP US); G03F 7/04 (2013.01 - KR); H05K 3/287 (2013.01 - EP US); Y10S 430/136 (2013.01 - EP US)

Citation (search report)

Designated contracting state (EPC)

CH DE FR GB IT LI NL

DOCDB simple family (publication)

EP 0502382 A1 19920909; DE 502382 T1 19930114; JP H05273753 A 19931022; KR 920018521 A 19921022; US 5312715 A 19940517

DOCDB simple family (application)

EP 92102959 A 19920221; DE 92102959 T 19920221; JP 8285392 A 19920304; KR 920003460 A 19920303; US 82937192 A 19920203