Global Patent Index - EP 0503744 A2

EP 0503744 A2 19920916 - Curable resin compositions and semiconductor devices coated and sealed with the same.

Title (en)

Curable resin compositions and semiconductor devices coated and sealed with the same.

Title (de)

Härtbare Harzzusammensetzungen und damit beschichtete und versiegelte Halbleiteranordnungen.

Title (fr)

Compositions de résines durcissables et dispositifs semi-conducteur qui en sont recouverts et scellés.

Publication

EP 0503744 A2 19920916 (EN)

Application

EP 92201125 A 19870303

Priority

JP 4834886 A 19860307

Abstract (en)

A thermosetting resin composition comprising at least a cycloaliphatic ether oligomer represented by the general formula (I): <CHEM> wherein m and n are each 0 to 30 and 2<m+n</=30, and a p-hydroxylstyrene polymer or copolymer represented by the general formula (III): <CHEM> wherein y is H, NH2, SO3H, Br or Cl and r is 5 to 300. The thermosetting resin composition is suitable for coating and sealing semiconductor device and improves heat resistance, humidity resistance and migration resistance of the semiconductor device coated and sealed thereby.

IPC 1-7

C08L 25/18; C08L 63/00

IPC 8 full level

C08G 59/00 (2006.01); C08G 59/02 (2006.01); C08G 59/20 (2006.01); C08G 59/24 (2006.01); C08G 59/32 (2006.01); C08G 59/40 (2006.01); C08G 59/50 (2006.01); C08G 59/62 (2006.01); C08L 63/00 (2006.01); H01B 3/40 (2006.01); H01B 3/44 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01)

CPC (source: EP KR)

B65G 47/12 (2013.01 - KR); C08G 59/02 (2013.01 - EP); C08G 59/24 (2013.01 - EP); C08G 59/3218 (2013.01 - EP); C08G 59/4042 (2013.01 - EP); C08G 59/5086 (2013.01 - EP); C08G 59/621 (2013.01 - EP); C08L 29/10 (2013.01 - KR); C08L 63/00 (2013.01 - EP KR); H01B 3/40 (2013.01 - EP); H01B 3/44 (2013.01 - EP); H01L 23/293 (2013.01 - EP); H01L 2924/0002 (2013.01 - EP)

C-Set (source: EP)

  1. C08L 63/00 + C08L 2666/04
  2. H01L 2924/0002 + H01L 2924/00

Designated contracting state (EPC)

DE FR GB

DOCDB simple family (publication)

EP 0503744 A2 19920916; EP 0503744 A3 19921209; EP 0237255 A2 19870916; EP 0237255 A3 19900530; JP H045041 B2 19920130; JP S62207320 A 19870911; KR 870008949 A 19871022; KR 940001716 B1 19940305

DOCDB simple family (application)

EP 92201125 A 19870303; EP 87301854 A 19870303; JP 4834886 A 19860307; KR 870001666 A 19870226