EP 0504142 A1 19920923 - SUBSTRATE AND METHOD FOR CULTURE OF FUNGI, INCLUDING SHIITAKE (LENTINUS EDODES).
Title (en)
SUBSTRATE AND METHOD FOR CULTURE OF FUNGI, INCLUDING SHIITAKE (LENTINUS EDODES).
Title (de)
SUBSTRAT UND ZUCHTVERFAHREN FÜR PILZE EINSCHLIESSLICH SHIITAKE (LENTINUS EDODES).
Title (fr)
SUBSTRAT ET PROCEDE DE CULTURE DE CHAMPIGNONS, DONT LE SHIITAKE (LENTINUS EDODES).
Publication
Application
Priority
US 37427089 A 19890629
Abstract (en)
[origin: WO9100002A1] An improved substrate and method for culturing fungi, including Shiitake. The substrate is essentially cellulose-free and comprises a major portion of grain and minor portions of nutritional supplements. The grain is partially sterilized by boiling in order to kill bacteria, cooled in order to induce germination of the heat resistant spores, and steam sterilized before the germinated spores have matured sufficiently to create new spores. The substrate is inoculated with fungi, which are then cultured.
Abstract (fr)
Substrat amélioré et procédé de culture de champignons, dont le Shiitake. Le substrat est essentiellement dépourvu de cellulose et comporte une portion importante de céréales et de petites portions de suppléments nutritionnels. Les céréales sont en partie stérélisées par ébullition afin de tuer des bactéries, refroidies afin de provoquer la germination des spores résistantes à la chaleur, et stérélisées à la vapeur avant que les spores germinées n'aient suffisamment mûri pour pouvoir créer de nouvelles spores. Le substrat est innoculé avec des champignons, qui sont ensuite cultivés.
IPC 1-7
IPC 8 full level
A01G 1/04 (2006.01); C12N 1/14 (2006.01); C12R 1/645 (2006.01)
CPC (source: EP)
A01G 18/20 (2018.01); A01G 18/40 (2018.01); A01G 18/50 (2018.01); A01G 18/64 (2018.01)
Designated contracting state (EPC)
AT BE CH DE DK ES FR GB IT LI LU NL SE
DOCDB simple family (publication)
WO 9100002 A1 19910110; AR 243930 A1 19930930; AU 6053490 A 19910117; BR 9007483 A 19920901; CA 2059274 A1 19901230; CN 1032567 C 19960821; CN 1049184 A 19910213; CN 1090966 A 19940824; CS 237990 A3 19920219; DK 205091 A 19920221; DK 205091 D0 19911220; EP 0504142 A1 19920923; EP 0504142 A4 19920522; FI 916135 A0 19911227; GB 2251250 A 19920701; GB 2251250 B 19940119; GB 9127448 D0 19920219; HU 906030 D0 19920428; HU T59277 A 19920528; IL 94900 A0 19910415; JP H05500305 A 19930128; NL 9021178 A 19920401; NZ 234286 A 19921028; OA 09526 A 19921115; PL 285860 A1 19910311; PT 94547 A 19910208; SE 9103854 D0 19911230; SE 9103854 L 19911230; TR 26187 A 19950215; ZA 905085 B 19920325
DOCDB simple family (application)
US 9003648 W 19900626; AR 31725190 A 19900627; AU 6053490 A 19900626; BR 9007483 A 19900626; CA 2059274 A 19900626; CN 90106529 A 19900629; CN 93114120 A 19931030; CS 237990 A 19900628; DK 205091 A 19911220; EP 90911078 A 19900626; FI 916135 A 19911227; GB 9127448 A 19911219; HU 603090 A 19900626; IL 9490090 A 19900628; JP 51045390 A 19900626; NL 9021178 A 19900626; NZ 23428690 A 19900628; OA 60120 A 19911227; PL 28586090 A 19900629; PT 9454790 A 19900629; SE 9103854 A 19911230; TR 64490 A 19900629; ZA 905085 A 19900629