Title (en)

Method for sealing a device such as an induction coil, and mould for carrying out the method.

Title (de)

Verfahren zum Abdichten einer Vorrichtung wie eine Induktionspule, und Form zur Durchführung des Verfahrens.

Title (fr)

Procédé d'étanchéification d'une pièce telle qu'une bobine d'induction et moule pour la mise en oeuvre du procédé.

Publication

EP 0511062 A1 19921028 (FR)

Application

EP 92401090 A 19920417

Priority

FR 9105120 A 19910425

Abstract (en)

Method for sealing a device such as an induction coil and mould for carrying out the method. The subject of the invention is a method for sealing a device such as an induction coil. For this purpose, the device is shrouded in a heat-settable vinyl resin (3). <IMAGE>

IPC 1-7

H01F 41/12

IPC 8 full level

B29C 67/00 (2006.01); H01F 41/12 (2006.01); B29K 27/06 (2006.01); B29L 31/34 (2006.01)

CPC (source: EP)

H01F 41/127 (2013.01)

Citation (search report)

• [X] GB 678936 A 19520910 - WESTINGHOUSE ELECTRIC INT CO
• [A] DE 1270884 B 19680620 - BOSCH GMBH ROBERT
• [A] US 3504431 A 19700407 - GUILBAULT LAWRENCE J, et al
• [A] GB 916100 A 19630116 - ASS ELECT IND
• [A] FR 2243509 A1 19750404 - SIEMENS AG [DE]
• [A] US 3352711 A 19671114 - NICHOLS FRANK S, et al
• [A] US 4983669 A 19910108 - PIERMATTIE VIRGINIA [US], et al
• [A] GB 2112258 A 19830713 - RUFFINI ROBERT STANLEY
• [A] CA 737883 A 19660705 - CHRYSLER CORP
• [A] PATENT ABSTRACTS OF JAPAN vol. 10, no. 158 (E-409)(2214) 6 Juin 1986 & JP-A-61 013 611 ( MITSUBISHI DENKI )

Designated contracting state (EPC)

AT BE CH DE DK ES FR GB GR IT LI LU MC NL PT SE

DOCDB simple family (publication)

EP 0511062 A1 19921028; EP 0511062 B1 19960717; AT E140558 T1 19960815; DE 69212208 D1 19960822; DE 69212208 T2 19970220; FR 2675943 A1 19921030; FR 2675943 B1 19941021; JP H05124114 A 19930521

DOCDB simple family (application)

EP 92401090 A 19920417; AT 92401090 T 19920417; DE 69212208 T 19920417; FR 9105120 A 19910425; JP 10699792 A 19920424