EP 0511062 B1 19960717 - Method for sealing a device such as an induction coil
Title (en)
Method for sealing a device such as an induction coil
Title (de)
Verfahren zum Abdichten einer Vorrichtung wie einer Induktionspule
Title (fr)
Procédé d'étanchéification d'une pièce telle qu'une bobine d'induction
Publication
Application
Priority
FR 9105120 A 19910425
Abstract (en)
[origin: EP0511062A1] Method for sealing a device such as an induction coil and mould for carrying out the method. The subject of the invention is a method for sealing a device such as an induction coil. For this purpose, the device is shrouded in a heat-settable vinyl resin (3). <IMAGE>
IPC 1-7
IPC 8 full level
B29C 67/00 (2006.01); H01F 41/12 (2006.01); B29K 27/06 (2006.01); B29L 31/34 (2006.01)
CPC (source: EP)
H01F 41/127 (2013.01)
Citation (examination)
- DERW/WPI,Jap.Abs.80-24601C,8014
- DERW/WPI,Jap.Abs.78-59808A,7833
- DERW/WPI,Jap.Abs.90-182614,9024
- DERW/WPI,Jap.Abs.82-04654E,8203
- Pat.Abs.Jap.13,no.42.,30/01/89
Designated contracting state (EPC)
AT BE CH DE DK ES FR GB GR IT LI LU MC NL PT SE
DOCDB simple family (publication)
EP 0511062 A1 19921028; EP 0511062 B1 19960717; AT E140558 T1 19960815; DE 69212208 D1 19960822; DE 69212208 T2 19970220; FR 2675943 A1 19921030; FR 2675943 B1 19941021; JP H05124114 A 19930521
DOCDB simple family (application)
EP 92401090 A 19920417; AT 92401090 T 19920417; DE 69212208 T 19920417; FR 9105120 A 19910425; JP 10699792 A 19920424