Global Patent Index - EP 0517594 A1

EP 0517594 A1 19921209 - Polishing machine with a tensioned finishing belt and an improved work supporting head.

Title (en)

Polishing machine with a tensioned finishing belt and an improved work supporting head.

Title (de)

Poliermaschine mit einem gespannten Feinschleifband und einem verbesserten Werkstückträgerkopf.

Title (fr)

Machine de polissage à bande microabrasive tendue et à tête support de plaquette perfectionnée.

Publication

EP 0517594 A1 19921209 (FR)

Application

EP 92401532 A 19920604

Priority

  • FR 9106866 A 19910606
  • FR 9106869 A 19910606

Abstract (en)

The machine according to the invention comprises a microabrasive belt (33) tensioned above a planar reference platform (30) between a feeding spool and a receiving spool (50), and a head (32) for supporting a specimen (44) comprising a rigid part (140) and a disc (142) made of a flexible material and capable of holding the face of the specimen (44) to be polished opposite the abrasive belt. Application to the polishing of silicon plates (wafers) containing integrated components, in particular magnetic read and write heads. <IMAGE>

IPC 1-7

B24B 21/20; B24B 37/04; H01L 21/00

IPC 8 full level

B24B 7/22 (2006.01); B24B 21/00 (2006.01); B24B 21/20 (2006.01); B24B 37/04 (2006.01); B24B 37/30 (2012.01)

CPC (source: EP US)

B24B 21/004 (2013.01 - EP US); B24B 21/20 (2013.01 - EP US); B24B 37/30 (2013.01 - EP US)

Citation (search report)

  • [A] EP 0349653 B1 19930721
  • [A] US 3453783 A 19690708 - QUEEN WILLIAM D
  • [A] US 4579313 A 19860401 - ADANI KEITH J [US], et al
  • [Y] PATENT ABSTRACTS OF JAPAN vol. 8, no. 83 (M-290)(1520) 17 Avril 1984 & JP-A-59 001 151 ( HITACHI SEISAKUSHO K.K. ) 6 Janvier 1984
  • [Y] SOLID STATE TECHNOLOGY vol. 20, no. 10, Octobre 1977, WASHINGTON US pages 55 - 62 A.C. BONORA 'FLEX-MOUNT POLISHING OF SILICON WAFERS'
  • [A] IBM TECHNICAL DISCLOSURE BULLETIN vol. 21, no. 10, Mars 1979, NEW YORK US page 4018 B. HOLLEY ET AL. 'MOUNTING METHOD FOR SINGLE-SIDE POLISHING'
  • [A] IBM TECHNICAL DISCLOSURE BULLETIN vol. 5, no. 1, Juin 1962, NEW YORK US page 6 A.W. TOLLKUHN 'SANDING OR POLISHING PAD'
  • [A] PATENT ABSTRACTS OF JAPAN vol. 7, no. 102 (M-211)(1247) 30 Avril 1983 & JP-A-58 22 657 ( HITACHI SEISAKUSHO K.K. )

Designated contracting state (EPC)

BE DE FR GB IT NL

DOCDB simple family (publication)

EP 0517594 A1 19921209; EP 0517594 B1 19951213; DE 69206685 D1 19960125; DE 69206685 T2 19960704; JP H05177523 A 19930720; US 5335453 A 19940809

DOCDB simple family (application)

EP 92401532 A 19920604; DE 69206685 T 19920604; JP 14429192 A 19920604; US 12712093 A 19930927