Title (en)

METHODS FOR PROCESSING PRINTED SUBSTRATES

Publication

EP 0518621 A3 19930331 (EN)

Application

EP 92305286 A 19920609

Priority

US 71282791 A 19910610

Abstract (en)

[origin: EP0518621A2] Methods for processing substrates printed with an ink layer having a non-planar surface topography, eg curved ink droplets, to produce a composite laminate and the composite laminates produced thereby are disclosed. A printed substrate is laminated to a transparent film using an intermediate adhesive layer. During lamination processing, the adhesive layer conforms to the surface topography of the printed ink layer, while the conformation of the printed ink layer remains substantially unchanged. The lamination processing methods are especially suitable for processing light transmissive substrates, such as transparencies, printed with phase change color inks to produce composite laminates that project clear, color saturated images upon overhead projection. <IMAGE>

IPC 1-7

B41J 2/01; B41M 7/00

IPC 8 full level

B41J 29/00 (2006.01); B41J 2/01 (2006.01); B41M 5/00 (2006.01); B41M 7/00 (2006.01)

CPC (source: EP)

B41J 2/01 (2013.01); B41M 7/0027 (2013.01)

Citation (search report)

• [AD] US 4853706 A 19890801 - VAN BRIMER R HUGH [US], et al
• [AP] EP 0435675 A2 19910703 - TEKTRONIX INC [US]
• [A] US 5009530 A 19910423 - KUZUYA SUSUMU [JP], et al
• [A] EP 0221552 A2 19870513 - HOWTEK INC [US]
• [A] EP 0148276 A1 19850717 - SONY CORP [JP]

Designated contracting state (EPC)

DE FR GB IT

DOCDB simple family (publication)

EP 0518621 A2 19921216; EP 0518621 A3 19930331; EP 0518621 B1 19961211; DE 69215763 D1 19970123; DE 69215763 T2 19970710; JP 2528772 B2 19960828; JP H07101172 A 19950418

DOCDB simple family (application)

EP 92305286 A 19920609; DE 69215763 T 19920609; JP 17607692 A 19920610