EP 0518640 B1 19951227 - Method for chamfering notch of wafer and apparatus therefor
Title (en)
Method for chamfering notch of wafer and apparatus therefor
Title (de)
Verfahren und Vorrichtung zum Abschrägen der Kerbe eines Plättchen
Title (fr)
Procédé et dispositif pour chanfreiner l'encoche d'une plaquette
Publication
Application
Priority
JP 16775291 A 19910612
Abstract (en)
[origin: EP0518640A1] A notch of a wafer is chamfered by a method which is characterized by disposing a rotary disklike grindstone and a wafer to be ground with the disklike grindstone in such a manner that the surfaces thereof intersect each other, relatively moving the grindstone and the wafer toward or away from each other, and meanwhile rotating the wafer within a prescribed angle around the central axis perpendicular to the surface of the wafer thereby effecting a work of chamfering the notch of the wafer in the circumferential direction and/or in the direction of thickness of the wafer. The chamfering is accomplished with an apparatus which comprises a rotating disklike grindstone, a wafer retaining mechanism capable of disposing a wafer and the grindstone in such a manner that the surfaces thereof intersect each other and, at the same time, retaining the wafer in such a manner as to be rotated around the central axis perpendicular to the surface of the wafer, a first drive mechanism for relatively moving the grindstone and the wafer toward or away from each other, a second drive mechanism for relatively moving the grindstone and the wafer in the direction of thickness of the wafer, and a control circuit capable of controlling the motions of the wafer retaining mechanism, the first drive mechanism, and the second drive mechanism thereby effecting the work of chamfering the notch of the wafer in the circumferential direction and/or in the direction of thickness of the wafer. <IMAGE>
IPC 1-7
IPC 8 full level
B24B 9/00 (2006.01); B24B 9/06 (2006.01); H01L 21/02 (2006.01); H01L 21/304 (2006.01); H01L 21/683 (2006.01)
CPC (source: EP US)
B24B 9/065 (2013.01 - EP US); H01L 21/6838 (2013.01 - EP US)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 0518640 A1 19921216; EP 0518640 B1 19951227; DE 69207075 D1 19960208; DE 69207075 T2 19960905; DE 69229920 D1 19991007; EP 0686460 A1 19951213; EP 0686460 B1 19990901; JP 2613504 B2 19970528; JP H04364727 A 19921217; US 5445554 A 19950829
DOCDB simple family (application)
EP 92305321 A 19920610; DE 69207075 T 19920610; DE 69229920 T 19920610; EP 95108917 A 19920610; JP 16775291 A 19910612; US 21504694 A 19940308