Global Patent Index - EP 0521405 B1

EP 0521405 B1 2001-04-18 - Heat radiating component and semiconductor device provided with the same

Title (en)

Heat radiating component and semiconductor device provided with the same

Title (de)

Wärmeabführendes Bauteil und damit versehene Halbleitervorrichtung

Title (fr)

Composant évacuant la chaleur et dispositif semi-conducteur qui en est muni

Publication

EP 0521405 B1 (EN)

Application

EP 92110805 A

Priority

  • JP 6347392 A
  • JP 16021091 A

Abstract (en)

[origin: EP0521405A1] Disclosed herein is a semiconductor laser provided with a heat radiating component which is improved in heat radiating property. The semiconductor laser comprises a heat radiating component for radiating heat which is generated in operation. In this heat radiating component, a polycrystalline diamond layer (3) synthesized by vapor deposition is formed on the upper surface of a stem (4). A semiconductor laser element (1) is brazed/bonded onto the surface of the vapor-deposited polycrystalline diamond layer (3) through a brazing filler metal (2). Also disclosed herein is a heat radiating component having a thermal expansion coefficient being coincident to that of an LSI chip to be mounted thereon, which is excellent in heat radiating property. <IMAGE>

IPC 1-7 (main, further and additional classification)

H01L 23/373; C23C 16/26

IPC 8 full level (invention and additional information)

H01L 23/373 (2006.01); H01L 23/433 (2006.01); H01L 23/495 (2006.01)

CPC (invention and additional information)

H01L 23/49513 (2013.01); H01L 23/3732 (2013.01); H01L 23/3736 (2013.01); H01L 23/4334 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/2908 (2013.01); H01L 2224/29083 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/0001 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01018 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01032 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/0104 (2013.01); H01L 2924/01041 (2013.01); H01L 2924/01042 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01072 (2013.01); H01L 2924/01073 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/0133 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/157 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/181 (2013.01)

Combination set (CPC)

  1. H01L 2224/48091 + H01L 2924/00014
  2. H01L 2924/0132 + H01L 2924/01014 + H01L 2924/01079
  3. H01L 2924/0132 + H01L 2924/01029 + H01L 2924/01042
  4. H01L 2924/0132 + H01L 2924/01029 + H01L 2924/01074
  5. H01L 2924/0133 + H01L 2924/01029 + H01L 2924/01042 + H01L 2924/01074
  6. H01L 2924/0132 + H01L 2924/0105 + H01L 2924/01079
  7. H01L 2924/0132 + H01L 2924/0105 + H01L 2924/01082 + H01L 2924/00012
  8. H01L 2224/73265 + H01L 2224/32245 + H01L 2224/48247 + H01L 2924/00012
  9. H01L 2924/0001 + H01L 2224/29099
  10. H01L 2924/00014 + H01L 2224/45099
  11. H01L 2924/00014 + H01L 2224/05599
  12. H01L 2924/12042 + H01L 2924/00
  13. H01L 2924/181 + H01L 2924/00012

Designated contracting state (EPC)

DE FR GB

EPO simple patent family

EP 0521405 A1 19930107; EP 0521405 B1 20010418; DE 69231790 D1 20010523; DE 69231790 T2 20020307; KR 960006208 B1 19960509; US 5299214 A 19940329

INPADOC legal status


2004-04-02 [REG FR ST] NOTIFICATION OF LAPSE

2004-02-27 [PG25 FR] LAPSED IN A CONTRACTING STATE ANNOUNCED VIA POSTGRANT INFORM. FROM NAT. OFFICE TO EPO

- Ref Country Code: FR

- Free text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

- Effective date: 20040227

2003-02-12 [GBPC] GB: EUROPEAN PATENT CEASED THROUGH NON-PAYMENT OF RENEWAL FEE

- Effective date: 20020626

2003-01-01 [PG25 DE] LAPSED IN A CONTRACTING STATE ANNOUNCED VIA POSTGRANT INFORM. FROM NAT. OFFICE TO EPO

- Ref Country Code: DE

- Free text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

- Effective date: 20030101

2002-06-26 [PG25 GB] LAPSED IN A CONTRACTING STATE ANNOUNCED VIA POSTGRANT INFORM. FROM NAT. OFFICE TO EPO

- Ref Country Code: GB

- Free text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

- Effective date: 20020626

2002-06-10 [PGFP FR] POSTGRANT: ANNUAL FEES PAID TO NATIONAL OFFICE

- Ref Country Code: FR

- Payment date: 20020610

- Year of fee payment: 11

2002-04-10 [26N] NO OPPOSITION FILED

2002-01-01 [REG GB IF02] EUROPEAN PATENT IN FORCE AS OF 2002-01-01

2001-08-30 [PGFP DE] POSTGRANT: ANNUAL FEES PAID TO NATIONAL OFFICE

- Ref Country Code: DE

- Payment date: 20010830

- Year of fee payment: 10

2001-08-22 [RIN2] INVENTOR (CORRECTION)

- Free text: NAKAMURA, TSUTOMU, C/O ITAMI WORKS SUMITOMO EL. * IGUCHI, TAKAHISA, C/O ITAMI WORKS SUMITOMO EL. * NAKAI, TETSUO, C/O ITAMI WORKS SUMITOMO EL.

2001-08-17 [ET] FR: TRANSLATION FILED

2001-06-12 [PGFP GB] POSTGRANT: ANNUAL FEES PAID TO NATIONAL OFFICE

- Ref Country Code: GB

- Payment date: 20010612

- Year of fee payment: 10

2001-05-23 [REF] CORRESPONDS TO:

- Document: DE 69231790 20010523

2001-04-18 [AK] DESIGNATED CONTRACTING STATES:

- Kind Code of Ref Document: B1

- Designated State(s): DE FR GB

1995-02-22 [17Q] FIRST EXAMINATION REPORT

- Effective date: 19950111

1993-03-17 [17P] REQUEST FOR EXAMINATION FILED

- Effective date: 19930111

1993-01-07 [AK] DESIGNATED CONTRACTING STATES:

- Kind Code of Ref Document: A1

- Designated State(s): DE FR GB