EP 0522787 A1 19930113 - Fabrication methods for micromechanical elements.
Title (en)
Fabrication methods for micromechanical elements.
Title (de)
Herstellungsverfahren für mikromechanische Elemente.
Title (fr)
Procédés de fabrication pour des éléments micromécaniques.
Publication
Application
Priority
US 72517491 A 19910703
Abstract (en)
A process in which concave surfaces to form undercut edges can be made and the application of such process to making micromechanical devices. Concave surfaces forming undercut edges are are made in a wall of a stationary structure extending from a planar surface by growing a convex bumper into the wall. The bumper forms a convexo-concave relationship with the wall. The bumper is then removed from the wall in such a manner as to preserve the concave, undercut surface of the wall. The stationary structure and the planar surface is then further processed by coating with a sacrificial layer, and a structural layer. The structural layer is patterned into a movable structure that is held onto the stationary structure by the curved, undercut edge such as the slot in a slider. Final processing includes removing the sacrificial layer to free the movable structure from the stationary structure. <IMAGE>
IPC 1-7
IPC 8 full level
B23P 11/00 (2006.01); B23P 15/00 (2006.01); C23F 17/00 (2006.01); F16C 33/14 (2006.01); G03F 7/00 (2006.01)
CPC (source: EP US)
B23P 11/00 (2013.01 - EP US); B23P 15/00 (2013.01 - EP US); G03F 7/00 (2013.01 - EP US)
Citation (search report)
- [AD] US 4740410 A 19880426 - MULLER RICHARD S [US], et al
- [AD] US 4375643 A 19830301 - YEH KEMING W, et al
- [A] EP 0232973 A2 19870819 - ROHM & HAAS [US]
- [A] IBM TECHNICAL DISCLOSURE BULLETIN vol. 25, no. 11B, April 1983, ARMONK,NY,US pages 6131 - 6142; DE LA MONEDA: 'PROCESSES TO REDUCE AND CONTROL THE P-TYPE DOPING CONCENTRATION AT THE BOUNDARY BETWEEN RECESSED OXIDE AND ACTIVE DEVICE REGIONS'
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
US 5149397 A 19920922; CA 2063769 A1 19930104; CA 2063769 C 19991109; DE 69222701 D1 19971120; DE 69222701 T2 19980507; EP 0522787 A1 19930113; EP 0522787 B1 19971015; JP H05230679 A 19930907
DOCDB simple family (application)
US 72517491 A 19910703; CA 2063769 A 19920323; DE 69222701 T 19920701; EP 92306093 A 19920701; JP 16949992 A 19920626