Global Patent Index - EP 0531222 B1

EP 0531222 B1 19961218 - Process for making a contact carrying blade of a switch by cutting a band and blade made by this process

Title (en)

Process for making a contact carrying blade of a switch by cutting a band and blade made by this process

Title (de)

Verfahren zur Herstellung eines kontakttragenden Blattes eines Schalters durch Herausschneiden in eines Bandes und nach diesem Verfahren hergestelltes Blatt

Title (fr)

Procédé de réalisation, par découpe dans un ruban, d'une lame porte-contacts d'interrupteur et lame réalisée selon le procédé

Publication

EP 0531222 B1 19961218 (FR)

Application

EP 92402422 A 19920904

Priority

FR 9110992 A 19910905

Abstract (en)

[origin: EP0531222A1] The blade is configured so as to connect electrically an input terminal (15) to one or the other of two output terminals (16, 17). It includes two reeds (3, 4) which, via their free ends (5, 6), joined before cutting, are mounted pivotably on a joint (2) solid with the input terminal (15). Electrical connection between the joint (2) and the reeds (3, 4) is ensured by coatings with a ductile metal. In order to make the blade, it is cut from the band which was previously coated with a layer of the metal. <IMAGE>

IPC 1-7

H01H 11/04; H01H 1/58

IPC 8 full level

H01H 1/58 (2006.01); H01H 11/04 (2006.01); H01H 5/18 (2006.01)

CPC (source: EP)

H01H 1/5833 (2013.01); H01H 11/04 (2013.01); H01H 5/18 (2013.01)

Citation (examination)

3405 - 3406 W. M. DAVIS 'wafer switch'

Designated contracting state (EPC)

CH DE GB IT LI

DOCDB simple family (publication)

EP 0531222 A1 19930310; EP 0531222 B1 19961218; DE 69216012 D1 19970130; DE 69216012 T2 19970612; FR 2681184 A1 19930312; FR 2681184 B1 19950331; HK 1000224 A1 19980206

DOCDB simple family (application)

EP 92402422 A 19920904; DE 69216012 T 19920904; FR 9110992 A 19910905; HK 97101735 A 19970906