EP 0536362 B1 19960703 - ETCHING SOLUTION
Title (en)
ETCHING SOLUTION
Title (de)
ÄTZLÖSUNG
Title (fr)
SOLUTION D'ATTAQUE
Publication
Application
Priority
- DE 9200321 W 19920421
- DE 4113283 A 19910424
Abstract (en)
[origin: WO9219792A1] An etching solution for removing a metallic layer from a substrate contains a hydrogenated compound that dissolves the metal itself while evolving hydrogen and a nitro-substituted organic compound. The solution is characterized by the fact that the selected nitro-substituted organic compound is a compound having an easily hydrogenizable nitro group.
IPC 1-7
IPC 8 full level
C23F 1/10 (2006.01); C23F 1/20 (2006.01); C23F 1/26 (2006.01); C23F 1/28 (2006.01); C23F 1/36 (2006.01); C23F 1/44 (2006.01)
CPC (source: EP US)
C23F 1/10 (2013.01 - EP US); C23F 1/20 (2013.01 - EP US); C23F 1/26 (2013.01 - EP US); C23F 1/28 (2013.01 - EP US); C23F 1/36 (2013.01 - EP US); C23F 1/44 (2013.01 - EP US)
Citation (examination)
METAL FINISHING Bd. 89, Nr. 1A, Januar 1991, Seiten 388-396; STANLEY HIRSCH: 'stripping metallic coatings' siehe Seite 392-Seite 394
Designated contracting state (EPC)
AT BE CH DE FR LI NL
DOCDB simple family (publication)
WO 9219792 A1 19921112; AT E140041 T1 19960715; DE 4113283 A1 19921029; DE 4113283 C2 19940505; DE 59206696 D1 19960808; EP 0536362 A1 19930414; EP 0536362 B1 19960703; JP H06500363 A 19940113; US 5462640 A 19951031
DOCDB simple family (application)
DE 9200321 W 19920421; AT 92908839 T 19920421; DE 4113283 A 19910424; DE 59206696 T 19920421; EP 92908839 A 19920421; JP 50795692 A 19920421; US 96280192 A 19921222