EP 0539183 A1 19930428 - Application of laminated interconnect media between a laminated power source and semiconductor devices.
Title (en)
Application of laminated interconnect media between a laminated power source and semiconductor devices.
Title (de)
Anwendung eines geschichteten Verbindungsmittels zwischen einer geschichteten Leistungsquelle und Halbleiteranordnungen.
Title (fr)
Application d'un moyen d'interconnexion laminé entre une source de puissance laminée et des dispositifs semi-conducteurs.
Publication
Application
Priority
US 78257091 A 19911025
Abstract (en)
A flat geometry interconnect media (10) connects the electrodes of a laminated power source (12) in electrical contact with positive and negative power input terminals on a planar substrate. The interconnect media is in the form of a flexible, laminated strip having a central conductive lamina (14) sandwiched between a pair of insulation laminae (16,18). The flexible, laminated interconnect media is folded about the anode (20) and cathode (22) of the laminated power source for presenting positive and negative battery terminals in substantially coplanar relation for electrical contact with substrate lands or metallization deposits situated on one side of a printed circuit board. The laminated battery supplies backup operating power to integrated circuit devices such as static random access memories. <IMAGE>
IPC 1-7
IPC 8 full level
G11C 5/14 (2006.01); H01L 23/495 (2006.01); H01L 23/58 (2006.01); H01M 10/04 (2006.01); H01M 50/50 (2021.01); H01M 4/60 (2006.01); H01M 6/18 (2006.01)
CPC (source: EP US)
G11C 5/141 (2013.01 - EP US); H01L 23/49593 (2013.01 - EP US); H01L 23/58 (2013.01 - EP US); H01M 10/0436 (2013.01 - EP US); H01M 50/50 (2021.01 - EP US); H01L 2924/0002 (2013.01 - EP US); H01M 4/60 (2013.01 - EP US); H01M 6/181 (2013.01 - EP US); Y02E 60/10 (2013.01 - EP); Y02P 70/50 (2015.11 - EP); Y10S 257/924 (2013.01 - EP US)
Citation (search report)
- [A] EP 0171089 A2 19860212 - HITACHI LTD [JP], et al
- [A] PATENT ABSTRACTS OF JAPAN vol. 10, no. 363 (E-461)5 December 1986 & JP-A-61 159 757 ( TOSHIBA ) 19 July 1986
- [A] PATENT ABSTRACTS OF JAPAN vol. 10, no. 367 (E-462)9 December 1986 & JP-A-61 164 257 ( NEC ) 24 July 1986
Designated contracting state (EPC)
DE FR GB IT
DOCDB simple family (publication)
US 5187564 A 19930216; EP 0539183 A1 19930428; JP H05234582 A 19930910
DOCDB simple family (application)
US 78257091 A 19911025; EP 92309626 A 19921021; JP 28788792 A 19921026