Global Patent Index - EP 0551832 B1

EP 0551832 B1 19970514 - Coating of yarn bundles, process for their manufacturing and textile made thereof

Title (en)

Coating of yarn bundles, process for their manufacturing and textile made thereof

Title (de)

Bondiertes Fadenbündel, Verfahren zu dessen Herstellung und daraus erhältliche textile Flächengebilde

Title (fr)

Faisceau de fils liés, procédé pour sa fabrication et produit textile qui en est composé

Publication

EP 0551832 B1 19970514 (DE)

Application

EP 93100149 A 19930107

Priority

DE 4200834 A 19920115

Abstract (en)

[origin: EP0551832A1] There is described a yarn bundle made of at least one twisted multifilament yarn comprising a first synthetic polymer, for example comprising polyethylene terephthalate, having a breaking strength of at least 42 cN/tex, whose individual filaments have become bonded together over essentially the entire thread cross-section by the melting on means of a second thermoplastic synthetic polymer, whose melting point is at least 10 DEG C below the melting or decomposition point of the first synthetic polymer, for example polybutadiene terephthalate. The yarn bundles are distinguished by a high strength, a good flexural stiffness and good resistance to hydrolysis and can be used in particular for manufacturing textile sheet materials for use in hot, moist environments, in particular as wire cloths for paper machines.

IPC 1-7

D02G 3/04; D02G 3/40

IPC 8 full level

B01D 39/08 (2006.01); D02G 3/04 (2006.01); D02G 3/40 (2006.01); D03D 15/00 (2006.01); D21F 1/10 (2006.01)

CPC (source: EP US)

D02G 3/402 (2013.01 - EP US); Y10S 57/905 (2013.01 - EP US); Y10S 162/903 (2013.01 - EP US); Y10T 428/2915 (2015.01 - EP US); Y10T 428/2931 (2015.01 - EP US); Y10T 428/2969 (2015.01 - EP US); Y10T 428/2973 (2015.01 - EP US); Y10T 442/313 (2015.04 - EP US); Y10T 442/339 (2015.04 - EP US)

Designated contracting state (EPC)

AT BE CH DE FR GB IT LI NL SE

DOCDB simple family (publication)

EP 0551832 A1 19930721; EP 0551832 B1 19970514; AT E153087 T1 19970515; DE 59306421 D1 19970619; FI 930130 A0 19930113; FI 930130 A 19930716; JP H05272020 A 19931019; MX 9300181 A 19930701; US 5366797 A 19941122

DOCDB simple family (application)

EP 93100149 A 19930107; AT 93100149 T 19930107; DE 59306421 T 19930107; FI 930130 A 19930113; JP 394793 A 19930113; MX 9300181 A 19930114; US 379893 A 19930113