Global Patent Index - EP 0552097 B1

EP 0552097 B1 19980311 - Process and apparatus for nickel electroplating

Title (en)

Process and apparatus for nickel electroplating

Title (de)

Verfahren und Vorrichtung zur Nickel-Elektroplattierung

Title (fr)

Appareil et procédé de révêtement électrolytique de nickel

Publication

EP 0552097 B1 19980311 (FR)

Application

EP 93400070 A 19930113

Priority

FR 9200407 A 19920116

Abstract (en)

[origin: EP0552097A1] Apparatus for electroplating a component with nickel by starting with nickel-plating baths employing nickel sulphamate as nickel input and consisting of receptacles containing the nickel-plating baths in which an anode and a cathode are immersed, characterised in that it comprises a semipermeable wall separating the cathode compartment from the anode compartment.

IPC 1-7

C25D 3/12; C25D 5/00

IPC 8 full level

C25D 3/12 (2006.01); C25D 5/00 (2006.01)

CPC (source: EP US)

C25D 3/12 (2013.01 - EP US); C25D 17/002 (2013.01 - EP US)

Designated contracting state (EPC)

BE CH DE LI

DOCDB simple family (publication)

EP 0552097 A1 19930721; EP 0552097 B1 19980311; DE 69317315 D1 19980416; DE 69317315 T2 19981015; FR 2686352 A1 19930723; FR 2686352 B1 19950616; US 5403460 A 19950404; ZA 93264 B 19940715

DOCDB simple family (application)

EP 93400070 A 19930113; DE 69317315 T 19930113; FR 9200407 A 19920116; US 520793 A 19930115; ZA 93264 A 19930115