EP 0553492 A2 19930804 - Low expansion composition for packaging optical waveguide couplers.
Title (en)
Low expansion composition for packaging optical waveguide couplers.
Title (de)
Zusammensetzung mit niedrigem Ausdehnungskoeffizient zur Verpackung von Wellenleiterkopplungen.
Title (fr)
Composition à faible coefficient de dilatation pour emballer des coupleurs de guides d'ondes.
Publication
Application
Priority
US 82596092 A 19920127
Abstract (en)
A rigid, low expansion formable housing composition can be used to package optical waveguide couplers. The housing is in intimate contact with and strongly bonded to the coupler being packaged. The housing composition includes a formable polymeric resin, a glass-ceramic or ceramic or glass filler, and, optionally, strengthening fibers. The filler has a low thermal expansion to compensate for the high expansion of the resin. A moisture barrier layer may be placed around the housing composition, and it is possible to incorporate a shock absorbing material between the housing and the moisture barrier layer. <IMAGE>
IPC 1-7
IPC 8 full level
G02B 6/287 (2006.01); C08K 3/40 (2006.01); G02B 6/28 (2006.01)
CPC (source: EP KR US)
C08K 3/40 (2013.01 - EP KR US); G02B 6/2821 (2013.01 - EP US); G02B 6/2835 (2013.01 - EP KR US)
Designated contracting state (EPC)
DE ES FR GB IT NL
DOCDB simple family (publication)
EP 0553492 A2 19930804; EP 0553492 A3 19940202; EP 0553492 B1 20020403; AU 3193393 A 19930729; AU 663752 B2 19951019; CA 2083983 A1 19930728; DE 69232534 D1 20020508; DE 69232534 T2 20020926; JP 2003090928 A 20030328; JP H05273434 A 19931022; KR 100299832 B1 20011022; KR 930016519 A 19930826; TW 213885 B 19931001; US 5426714 A 19950620
DOCDB simple family (application)
EP 92122067 A 19921228; AU 3193393 A 19930121; CA 2083983 A 19921127; DE 69232534 T 19921228; JP 2002195238 A 20020531; JP 2596693 A 19930122; KR 930001109 A 19930127; TW 82100456 A 19930121; US 24981694 A 19940526