Global Patent Index - EP 0557013 A1

EP 0557013 A1 19930825 - Stamp device capable of perforating thermal stencil paper.

Title (en)

Stamp device capable of perforating thermal stencil paper.

Title (de)

Stempelvorrichtung zum Perforieren eines thermischen Schablonenapiers.

Title (fr)

Dispositif de tampon capable d'effectuer la perforation d'un papier stencil thermique.

Publication

EP 0557013 A1 19930825

Application

EP 93300994 A 19930211

Priority

JP 3496192 A 19920221

Abstract (en)

To eliminate wasteful use of thermal stencil paper and thereby provide an inexpensive stamp device, a single thermal head is employed for both the thermal recording on a reversible thermal recording sheet for confirmation of a stamp image and the thermal perforation through the thermal stencil paper for creation of a stamp original. The stamp image is first thermally recorded on the reversible thermal recording sheet; the stamp image thus recorded is then confirmed; and the thermal stencil paper is thermally perforated in accordance with the stamp image to create the stamp original. The stamp device of the present invention includes a thermal head 19, a thermal stencil paper 24 adapted to be thermally perforated by the thermal head 19 to form a dot image as a stamp image, a reversible thermal recording sheet 101 adapted to be heated by the thermal head 19 to thermally record an image corresponding to the stamp image, so as to confirm the stamp image, and a heating roller pair 90 for erasing the image thermally recorded on the reversible thermal recording sheet 101. <IMAGE>

IPC 1-7

B41K 1/32; B65H 3/44

IPC 8 full level

B41C 1/055 (2006.01); B41K 1/32 (2006.01); B41K 3/36 (2006.01)

CPC (source: EP)

B41K 1/32 (2013.01)

Citation (search report)

  • [T] EP 0493965 A1 19920708 - BROTHER IND LTD [JP]
  • [A] PATENT ABSTRACTS OF JAPAN vol. 12, no. 142 (M-692)30 April 1988 & JP-A-62 264 995 ( FUJI XEROX CO. LTD ) 17 November 1987
  • [A] PATENT ABSTRACTS OF JAPAN vol. 16, no. 34 (M-1204)28 January 1992 & JP-A-32 43 387 ( PILOT CORP:THE ) 30 October 1991

Designated contracting state (EPC)

DE FR GB

DOCDB simple family (publication)

EP 0557013 A1 19930825; EP 0557013 B1 19960710; DE 69303511 D1 19960814; DE 69303511 T2 19961212; JP H05229089 A 19930907

DOCDB simple family (application)

EP 93300994 A 19930211; DE 69303511 T 19930211; JP 3496192 A 19920221