EP 0558872 B1 19960828 - Method and apparatus for winding of windable substrates
Title (en)
Method and apparatus for winding of windable substrates
Title (de)
Verfahren und Vorrichtung zum Aufwickeln von wickelfähigen Substraten
Title (fr)
Procédé et dispositif pour enrouler des substrats enroulables
Publication
Application
Priority
EP 92810166 A 19920304
Abstract (en)
[origin: US5374006A] A substrate capable of being wound is transported to a substrate carrier and wound onto the latter. For that purpose the substrate is first held in a defined storage position. With the substrate in that storage position the substrate carrier is moved into a threading position and brought into engagement with the substrate. The substrate is then automatically threaded around the substrate carrier. When the threading operation is complete, the substrate carrier is moved into a winding position in which the substrate is wound onto the substrate carrier. The rate of feed at which the substrate is transported by a motor to the substrate carrier is regulatable. The substrate carrier is motor-driven in a controllable manner, at a uniform torque and in dependence on the feed rate at which the substrate is transported to the substrate carrier. When the winding operation is complete the substrate is cut and the end of the substrate belonging to the winding is automatically fixed to the winding, while the other end of the substrate is again held in the defined storage position.
IPC 1-7
IPC 8 full level
B65H 19/28 (2006.01); B65H 23/198 (2006.01); B65H 75/28 (2006.01); D06B 23/04 (2006.01); D06B 23/10 (2006.01)
CPC (source: EP US)
B65H 19/28 (2013.01 - EP US); B65H 23/198 (2013.01 - EP US); B65H 75/28 (2013.01 - EP US); D06B 23/10 (2013.01 - EP US); B65H 2301/41426 (2013.01 - EP US); B65H 2301/522 (2013.01 - EP US)
Designated contracting state (EPC)
AT BE CH DE DK ES FR GB GR IT LI LU NL PT SE
DOCDB simple family (publication)
US 5374006 A 19941220; AT E141891 T1 19960915; DE 59207005 D1 19961002; DK 0558872 T3 19960916; EP 0558872 A1 19930908; EP 0558872 B1 19960828; ES 2091439 T3 19961101; GR 3020901 T3 19961130; HK 1002233 A1 19980807; JP H0648624 A 19940222; TW 242657 B 19950311
DOCDB simple family (application)
US 2169693 A 19930224; AT 92810166 T 19920304; DE 59207005 T 19920304; DK 92810166 T 19920304; EP 92810166 A 19920304; ES 92810166 T 19920304; GR 960402057 T 19960829; HK 98101274 A 19980219; JP 6933993 A 19930304; TW 82101231 A 19930222