Global Patent Index - EP 0562977 B1

EP 0562977 B1 19951129 - Process for making ceramic insulated supports by piling up layers.

Title (en)

Process for making ceramic insulated supports by piling up layers.

Title (de)

Verfahren zum Herstellen von keramischen Durchführungsisolatoren durch den Aufbau von mehreren Schichten.

Title (fr)

Procédé d'obtention d'inserts céramiques isolants par empilement multicouches.

Publication

EP 0562977 B1 19951129 (FR)

Application

EP 93420119 A 19930316

Priority

FR 9204257 A 19920323

Abstract (en)

[origin: US5346749A] A process for manufacturing insulating ceramic inserts used as sealed passages for electrical conductors through a metallic wall, is described wherein a green ceramic plate is subjected to silk-screen printing with the aid of a conducting ink, generally in ring-shaped patterns. The patterns are pressed and holes are pierced through the center of the ring and through at least one other green plate. The silk-screen printed plate is pressed against the at least one other green plate, or between two other green plates, bringing the holes into coincidence. A cut-out is made around each of the holes and the outer lateral surface of the part obtained is metallized. The part is then heat treated in order to fire and sinter same. It also is possible for the sintering to be performed before the metallization of the outer lateral surface.

IPC 1-7

H01B 19/00; H01B 17/58; B28B 1/00

IPC 8 full level

C04B 37/00 (2006.01); B28B 1/00 (2006.01); C04B 41/88 (2006.01); C04B 41/91 (2006.01); H01B 3/00 (2006.01); H01B 17/58 (2006.01); H01B 19/00 (2006.01)

CPC (source: EP US)

B28B 1/002 (2013.01 - EP US); H01B 17/58 (2013.01 - EP US); H01B 19/00 (2013.01 - EP US); Y10S 428/901 (2013.01 - EP US); Y10T 428/24917 (2015.01 - EP US); Y10T 428/24926 (2015.01 - EP US)

Designated contracting state (EPC)

DE FR GB

DOCDB simple family (publication)

US 5346749 A 19940913; DE 69300885 D1 19960111; DE 69300885 T2 19960523; EP 0562977 A1 19930929; EP 0562977 B1 19951129; FR 2688929 A1 19930924; FR 2688929 B1 19940520; IL 105130 A0 19930708; IL 105130 A 19960119; JP 3500162 B2 20040223; JP H06176618 A 19940624

DOCDB simple family (application)

US 3859993 A 19930323; DE 69300885 T 19930316; EP 93420119 A 19930316; FR 9204257 A 19920323; IL 10513093 A 19930322; JP 6417093 A 19930323