EP 0565070 B1 19970730 - Electroplating process
Title (en)
Electroplating process
Title (de)
Verfahren zum galvanischen Aufbringen einer Oberflächenbeschichtung
Title (fr)
Procédé d'électrodéposition
Publication
Application
Priority
DE 4211881 A 19920409
Abstract (en)
[origin: US5415761A] A process for electrochemically depositing a structured surface layer on a component, such as a machine component, particularly a steel water cylinder of a printing press, is disclosed. The process comprises the steps of defining an electrical parameter, such as a potential and/or an electrical current, effecting an electro-chemical layer deposition; and depositing a surface layer on the component with a structured outer surface topography. The depositing step is performed by providing an initial pulse of the electrical parameter and forming a plurality of island formations of deposition material on a surface of the component to be electro-chemically coated, and subsequently providing a follow-up pulse of the electrical parameter and causing a growth of the deposition material on the plurality of islands for causing the structured outer surface topography.
IPC 1-7
IPC 8 full level
CPC (source: EP US)
C25D 5/14 (2013.01 - EP US); C25D 5/18 (2013.01 - EP US); C25D 5/605 (2020.08 - EP US); C25D 5/625 (2020.08 - EP US)
Designated contracting state (EPC)
AT CH FR GB IT LI
DOCDB simple family (publication)
US 5415761 A 19950516; AT E156201 T1 19970815; DE 4211881 A1 19931014; DE 4211881 C2 19940728; EP 0565070 A1 19931013; EP 0565070 B1 19970730
DOCDB simple family (application)
US 4504293 A 19930407; AT 93105726 T 19930407; DE 4211881 A 19920409; EP 93105726 A 19930407