EP 0568087 A2 19931103 - Reflow mounting of electronic component on mounting board.
Title (en)
Reflow mounting of electronic component on mounting board.
Title (de)
Einbau von elektronischen Komponenten auf Montageplatten mit Hilfe der Reflow-Technik.
Title (fr)
Montage des composants électroniques sur des plaquettes de montage par soudage du type à refusion.
Publication
Application
Priority
JP 13980492 A 19920501
Abstract (en)
A process for reflow mounting an electronic component comprises the steps of coating the terminal electrode with a second solder having a second melting point higher than the reflow temperature, placing the mounting board, with the electronic component placed on the mounting land, on a conveyor which may be brought into contact with the second solder on the terminal electrode. The terminal electrode may be coated with a solder repelling material at a selected dividing area effective for dividing the terminal electrode into a plurality of sections substantially isolated from each other in terms of a flow of a solder. Alternatively, a mounting jig may be used for supporting the mounting board without bringing the second solder on the terminal electrode into contact with the mounting jig. <IMAGE>
IPC 1-7
IPC 8 full level
B23K 1/00 (2006.01); B23K 1/20 (2006.01); H05K 3/24 (2006.01); H05K 3/34 (2006.01); H05K 1/11 (2006.01)
CPC (source: EP US)
B23K 1/0016 (2013.01 - EP US); B23K 1/20 (2013.01 - EP US); H05K 3/3405 (2013.01 - EP US); H05K 3/3452 (2013.01 - EP US); H05K 3/3463 (2013.01 - EP US); H05K 1/117 (2013.01 - EP US); H05K 2201/0373 (2013.01 - EP US); H05K 2201/09381 (2013.01 - EP US); H05K 2201/094 (2013.01 - EP US); H05K 2201/099 (2013.01 - EP US); H05K 2203/043 (2013.01 - EP US); H05K 2203/047 (2013.01 - EP US)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 0568087 A2 19931103; EP 0568087 A3 19951115; EP 0568087 B1 20000329; DE 69328211 D1 20000504; DE 69328211 T2 20000928; JP H05315734 A 19931126; US 5373113 A 19941213
DOCDB simple family (application)
EP 93107049 A 19930430; DE 69328211 T 19930430; JP 13980492 A 19920501; US 5369993 A 19930429