EP 0574662 A3 19940525 - INSULATED SEMICONDUCTOR PACKAGE
Title (en)
INSULATED SEMICONDUCTOR PACKAGE
Publication
Application
Priority
US 89864192 A 19920615
Abstract (en)
[origin: EP0574662A2] The present invention includes a semiconductor package (20) that has a leadframe (10). An insulator (13) is mounted on a surface of a flag (11) of the leadframe (10) to insulate a portion of the leadframe (10) from the external environment. A semiconductor die (16) is also mounted on the flag (11), spaced away from the insulator (13). A portion of the leadframe (10), the semiconductor die (16), and a portion of the insulator (13) are encapsulated by a body (21) of the package (20). The body (21) also has an alignment hole (23) that extends from a surface of the body to the insulator (13), and exposes a portion of a surface of the insulator (13). In addition, the body (21) overlaps the insulator (13) and forms a seal to the insulator (13) thereby protecting the leadframe (10) from the external environment. <IMAGE>
IPC 1-7
IPC 8 full level
H01L 21/56 (2006.01); H01L 23/28 (2006.01); H01L 23/495 (2006.01)
CPC (source: EP US)
H01L 21/565 (2013.01 - EP US); H01L 23/49562 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48247 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01014 (2013.01 - EP US); H01L 2924/181 (2013.01 - EP US)
Citation (search report)
- [A] EP 0257681 A2 19880302 - SGS MICROELETTRONICA SPA [IT]
- [PX] PATENT ABSTRACTS OF JAPAN vol. 016, no. 513 (E - 1283) 22 October 1992 (1992-10-22)
- [X] PATENT ABSTRACTS OF JAPAN vol. 013, no. 383 (E - 811) 24 August 1989 (1989-08-24)
- [X] PATENT ABSTRACTS OF JAPAN vol. 013, no. 386 (E - 812) 25 August 1989 (1989-08-25)
- [X] PATENT ABSTRACTS OF JAPAN vol. 010, no. 263 (E - 435) 9 September 1986 (1986-09-09)
Designated contracting state (EPC)
DE FR GB IT
DOCDB simple family (publication)
EP 0574662 A2 19931222; EP 0574662 A3 19940525; CN 1080091 A 19931229; JP H0653358 A 19940225; US 5309027 A 19940503
DOCDB simple family (application)
EP 93105658 A 19930405; CN 93107299 A 19930614; JP 14126593 A 19930521; US 89864192 A 19920615