EP 0593057 A1 19940420 - Planarization apparatus and method for performing a planarization operation.
Title (en)
Planarization apparatus and method for performing a planarization operation.
Title (de)
Flachläppvorrichtung und Verfahren zur Durchführung eines Flachläppprozesses.
Title (fr)
Dispositif de planarisation et procédé pour réaliser une opération de planarisation.
Publication
Application
Priority
US 96156592 A 19921015
Abstract (en)
Described is a method and apparatus for improving planarity of substrates, like semiconductor wafers by chemical and/or mechanical means. The wafer (31) is affixed to the planar surface (32) of a carrier (33). A planar platen (35), on which is mounted a polishing pad (37), is moved about in a plane parallel to the pad surface with either an orbital, fixed-direction vibratory, or random-direction vibratory motion. In one embodiment of the invention, pressure between the surface of the wafer (31) to be polished and the moving polishing pad (37) is generated by the force of gravity acting on at least the wafer (31) and the carrier (33); in another embodiment the pressure is provided by a mechanical force applied normal to the wafer surface. The polishing pad (37) is wetted with a slurry (40) having abrasive particles suspended in a liquid which may be chemically reactive with respect to at least one material on the wafer (31). <IMAGE>
IPC 1-7
IPC 8 full level
B24B 1/00 (2006.01); B24B 37/04 (2006.01); B24B 37/10 (2012.01); H01L 21/00 (2006.01); H01L 21/304 (2006.01)
CPC (source: EP KR US)
B24B 37/102 (2013.01 - EP US); H01L 21/302 (2013.01 - KR); H01L 21/67023 (2013.01 - EP US); Y10S 438/959 (2013.01 - EP US)
Citation (search report)
- [X] US 3559346 A 19710202 - PAOLA CARL R
- [X] US 3978622 A 19760907 - MAZUR ROBERT G, et al
- [X] US 3748790 A 19730731 - PIZZARELLO F, et al
- [X] US 3137977 A 19640623 - GRAVES GEORGE W
- [X] US 3906678 A 19750923 - ROTH KURT H
- [A] US 4239567 A 19801216 - WININGS RICHARD H [US]
- [A] US 5020283 A 19910604 - TUTTLE MARK E [US]
- [A] DE 3411120 A1 19841108 - TOTO LTD [JP]
- [A] EP 0121707 A2 19841017 - IBM [US]
Designated contracting state (EPC)
BE DE ES FR GB IT NL
DOCDB simple family (publication)
US 5232875 A 19930803; EP 0593057 A1 19940420; JP H06224165 A 19940812; KR 100272112 B1 20001201; KR 940010222 A 19940524
DOCDB simple family (application)
US 96156592 A 19921015; EP 93116644 A 19931014; JP 25838493 A 19931015; KR 930021377 A 19931015