Global Patent Index - EP 0596414 B1

EP 0596414 B1 20020102 - Semiconductor integrated circuit device comprising a dielectric isolation structure

Title (en)

Semiconductor integrated circuit device comprising a dielectric isolation structure

Title (de)

Halbleiteranordnung mit dielektrischer Isolationsstruktur für integrierte Schaltung

Title (fr)

Dispositif semi-conducteur comportant une structure d'isolation diélectrique pour circuit intégré

Publication

EP 0596414 B1 20020102 (EN)

Application

EP 93117515 A 19931028

Priority

JP 29678692 A 19921106

Abstract (en)

[origin: EP0596414A2] A semiconductor integrated circuit has a multilayered supporter (2, 22, 23) and one or more semiconductor islands (1) being disposed on the supporter (2, 22, 23) and being insulated against it by an insulating film (21). Within the islands (1), circuit elements are formed. The circuit further comprises an auxiliary electrode (33) provided at the supporter (2, 22, 23). <IMAGE>

IPC 1-7

H01L 21/76; H01L 21/74; H01L 29/06; H01L 21/762; H01L 21/762

IPC 8 full level

H01L 21/762 (2006.01); H01L 27/06 (2006.01); H01L 29/06 (2006.01); H01L 29/10 (2006.01); H01L 29/40 (2006.01); H01L 29/78 (2006.01); H01L 29/861 (2006.01); H02P 6/08 (2006.01)

CPC (source: EP US)

H01L 21/76297 (2013.01 - EP US); H01L 27/0623 (2013.01 - EP US); H01L 29/0611 (2013.01 - EP US); H01L 29/1083 (2013.01 - EP US); H01L 29/402 (2013.01 - EP US); H01L 29/7813 (2013.01 - EP US); H01L 29/7824 (2013.01 - EP US); H01L 29/8611 (2013.01 - EP US); H02P 6/085 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US)

Citation (examination)

WO 9111028 A1 19910725 - HARRIS CORP [US]

Designated contracting state (EPC)

DE FR GB

DOCDB simple family (publication)

EP 0596414 A2 19940511; EP 0596414 A3 19971015; EP 0596414 B1 20020102; CA 2102079 A1 19940507; CA 2102079 C 19990105; DE 69331408 D1 20020207; DE 69331408 T2 20020808; JP H06151573 A 19940531; US 5463243 A 19951031; US 5747829 A 19980505; US 5977606 A 19991102

DOCDB simple family (application)

EP 93117515 A 19931028; CA 2102079 A 19931029; DE 69331408 T 19931028; JP 29678692 A 19921106; US 14731493 A 19931105; US 2851198 A 19980223; US 89508697 A 19970715