EP 0598763 B1 19951213 - ACID BATH FOR THE GALVANIC DEPOSITION OF COPPER, AND THE USE OF SUCH A BATH
Title (en)
ACID BATH FOR THE GALVANIC DEPOSITION OF COPPER, AND THE USE OF SUCH A BATH
Title (de)
SAURES BAD ZUR GALVANISCHEN ABSCHEIDUNG VON KUPFER UND DESSEN VERWENDUNG
Title (fr)
BAIN ACIDE DE DEPOT GALVANIQUE DE CUIVRE ET SON UTILISATION
Publication
Application
Priority
- DE 4126502 A 19910807
- DE 9200605 W 19920722
Abstract (en)
[origin: US5433840A] PCT No. PCT/DE92/00605 Sec. 371 Date Apr. 6, 1994 Sec. 102(e) Date Apr. 6, 1994 PCT Filed Jul. 22, 1992 PCT Pub. No. WO93/03204 PCT Pub. Date Feb. 18, 1993.An aqueous acid bath for the galvanic deposition of bright, ductile and smooth copper coats which is suitable for decorative purposes as well as for strengthening the conductors of printed circuits. The bath is characterized by a content of polyalkylene glycol ether. When combined with thio compounds containing water-soluble groups, these additions produce an electrolyte with excellent stability. Polymeric phenazonium compounds, polymeric nitrogen compounds and/or thio compounds containing nitrogen may also be successfully combined, in addition, depending on the desired properties.
IPC 1-7
IPC 8 full level
CPC (source: EP US)
C25D 3/38 (2013.01 - EP US)
Designated contracting state (EPC)
AT DE ES FR GB IT NL SE
DOCDB simple family (publication)
US 5433840 A 19950718; AT E131546 T1 19951215; CA 2115062 A1 19930218; CA 2115062 C 20051122; DE 4126502 C1 19930211; DE 59204703 D1 19960125; EP 0598763 A1 19940601; EP 0598763 B1 19951213; ES 2082486 T3 19960316; JP 3121346 B2 20001225; JP H07505187 A 19950608; WO 9303204 A1 19930218
DOCDB simple family (application)
US 19301694 A 19940406; AT 92916259 T 19920722; CA 2115062 A 19920722; DE 4126502 A 19910807; DE 59204703 T 19920722; DE 9200605 W 19920722; EP 92916259 A 19920722; ES 92916259 T 19920722; JP 50317193 A 19920722