EP 0600436 A2 19940608 - Semiconductor device, circuit and method of manufacture.
Title (en)
Semiconductor device, circuit and method of manufacture.
Title (de)
Halbleiteranordnung, Schaltung und Verfahren zur Herstellung.
Title (fr)
Dispositif semi-conducteur, circuit et procédé de fabrication.
Publication
Application
Priority
US 98509592 A 19921130
Abstract (en)
A monolithic integrated circuit capable of operation in the microwave range which is fabricated using silicon technology wherein transmission line interconnects are fabricated along with active devices on the same substrate. The transmission line is provided using polycrystalline silicon since it can have much higher resistivity than single crystal silicon. Accordingly, a circuit is provided wherein active devices are provided in single crystal silicon and interconnects are formed overlying polycrystalline silicon to provide transmission line interconnects between devices and obtain the desired high frequency response. This is accomplished by providing a highly doped silicon substrate of predetermined conductivity type having a less highly doped silicon layer thereon of the same conductivity type with an oxide layer over the less highly doped layer, forming mesas for formation therein of active elements in the structure having valleys between the mesas extending into the substrate, filling the valleys with very high resistivity polysilicon, forming an electrically insulating layer over the polysilicon, forming active elements with contacts thereto in the mesas and forming interconnects between contacts of the active elements extending over the high resistivity polysilicon regions and the electrically insulating material thereover. <IMAGE>
IPC 1-7
IPC 8 full level
H01L 21/76 (2006.01); H01L 21/762 (2006.01); H01L 21/768 (2006.01); H01L 23/36 (2006.01); H01L 23/532 (2006.01); H01L 23/66 (2006.01); H01P 11/00 (2006.01)
CPC (source: EP US)
H01L 21/76297 (2013.01 - EP US); H01L 21/768 (2013.01 - EP US); H01L 23/36 (2013.01 - EP US); H01L 23/53271 (2013.01 - EP US); H01L 23/66 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US)
Designated contracting state (EPC)
DE FR GB IT NL
DOCDB simple family (publication)
EP 0600436 A2 19940608; EP 0600436 A3 19971001; EP 0600436 B1 20030730; DE 69333124 D1 20030904; DE 69333124 T2 20040506; JP H0750339 A 19950221; US 5457068 A 19951010; US 5612556 A 19970318
DOCDB simple family (application)
EP 93119271 A 19931130; DE 69333124 T 19931130; JP 29845593 A 19931129; US 42776195 A 19950425; US 98509592 A 19921130