EP 0607441 B1 19981209 - ABRADING DEVICE AND ABRADING METHOD EMPLOYING THE SAME
Title (en)
ABRADING DEVICE AND ABRADING METHOD EMPLOYING THE SAME
Title (de)
SCHLEIFVORRICHTUNG UND VERFAHREN ZUR VERWENDUNG DESSELBEN
Title (fr)
DISPOSITIF ABRASIF ET PROCEDE D'ABRASION UTILISANT CE DISPOSITIF
Publication
Application
Priority
- JP 2303593 A 19930210
- JP 5929292 A 19920212
- JP 9300173 W 19930212
Abstract (en)
[origin: WO9315878A1] A device for abrading a large-scale flat substrate such as a silicon wafer, a quartz substrate, a glass substrate, and a metallic substrate. A sample (B) is abraded and worked by means of an abrading surface plate (1) while it is fixed by means of a vacuum chuck (4) on a sample holding table (3) with an abrasive (8) being supplied from an abrasive supplying nozzle (7). An elastic body (201) is secured to the underside of the abrading surface plate (1), and an abrasive cloth (2) is then secured to the underside of the elastic body. Since a hard type of abrasive cloth (2) is used, micro recessed and raised portions of the sample (B) can be worked to become smooth, and the elastic body (201) acts to realize uniform working.
IPC 1-7
IPC 8 full level
B24B 41/06 (2012.01)
CPC (source: EP)
B24B 37/12 (2013.01); B24B 37/30 (2013.01); B24B 41/068 (2013.01)
Designated contracting state (EPC)
DE GB NL
DOCDB simple family (publication)
WO 9315878 A1 19930819; DE 69322491 D1 19990121; DE 69322491 T2 19990826; EP 0607441 A1 19940727; EP 0607441 A4 19940824; EP 0607441 B1 19981209
DOCDB simple family (application)
JP 9300173 W 19930212; DE 69322491 T 19930212; EP 93904297 A 19930212