Global Patent Index - EP 0608905 A1

EP 0608905 A1 19940803 - Method for producing solder that contains therein additive particles maintaining its shape.

Title (en)

Method for producing solder that contains therein additive particles maintaining its shape.

Title (de)

Verfahren zum Herstellen eines Weichlotes, das ihre Form behaltende Zusatzpartikeln enthält.

Title (fr)

Procédé pour la fabrication d'une soudure tendre contenant des particules d'addition conservant leur forme.

Publication

EP 0608905 A1 19940803 (EN)

Application

EP 94101392 A 19940131

Priority

JP 1395693 A 19930129

Abstract (en)

Of two sheet-like solder stocks, one sheet-like solder stock is fed at a constant speed, and additive particles having a constant particle diameter are spread on an upper surface of the one solder material sheet in a quantitative fixed quantity. The other sheet-like solder stock is stacked on the upper surface of the one sheet-like solder stock, and the two stacked solder stocks are rolled and integrally laminated by rollers. The laminated solder sheet is cut into a plurality of narrow solder strips. Each of the solder strips is wound on a reel, and supplied as a die bonding material capable of being used for the die bonding. Thus, if this solder is used for a semiconductor chip die bonding, the unevenness in thickness of the solder layer directly under the die-bonded semiconductor chip becomes small, and it is possible to minimize the error in the semiconductor chip recognition in the case of the wire bonding. <IMAGE>

IPC 1-7

B23K 35/14

IPC 8 full level

B23K 35/40 (2006.01); B23K 35/02 (2006.01); B23K 35/14 (2006.01); H01L 21/52 (2006.01)

CPC (source: EP US)

B23K 35/0238 (2013.01 - EP US); H01L 24/27 (2013.01 - EP US); H01L 24/743 (2013.01 - EP US); B23K 35/0244 (2013.01 - EP US); B23K 35/40 (2013.01 - EP US); B23K 2101/40 (2018.07 - EP US); H01L 2224/83101 (2013.01 - EP US)

Citation (search report)

Designated contracting state (EPC)

DE FR GB NL

DOCDB simple family (publication)

EP 0608905 A1 19940803; EP 0608905 B1 19980603; DE 69410645 D1 19980709; DE 69410645 T2 19990211; JP H06232188 A 19940819; KR 0120916 B1 19971020; US 5377899 A 19950103

DOCDB simple family (application)

EP 94101392 A 19940131; DE 69410645 T 19940131; JP 1395693 A 19930129; KR 19940001631 A 19940129; US 18883194 A 19940131