Global Patent Index - EP 0610971 B1

EP 0610971 B1 20000927 - Semiconductor device assembly comprising a leadframe structure

Title (en)

Semiconductor device assembly comprising a leadframe structure

Title (de)

Halbleiteranordnung mit Leiterrahmen

Title (fr)

Dispositif semi-conducteur comprenant un cadre conducteur

Publication

EP 0610971 B1 20000927 (EN)

Application

EP 94106948 A 19890731

Priority

  • EP 89307740 A 19890731
  • JP 19645388 A 19880806

Abstract (en)

[origin: EP0354696A2] First (30) and second (40) frame bodies are used to fabricate a semiconductor device. The first frame body (30) includes a die pad (33). The second frame body (40) includes a plurality of leads (42). The die pad is depressed by a predetermined amount (h) which is equal or greater than the thickness of a semiconductor chip (50) to be mounted on the die pad. The two frame bodies are welded, and wire bonding and cutting of the leads are performed.

IPC 1-7

H01L 23/495

IPC 8 full level

H01L 23/28 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 23/50 (2006.01)

CPC (source: EP KR US)

H01L 23/02 (2013.01 - KR); H01L 23/3135 (2013.01 - EP US); H01L 23/48 (2013.01 - KR); H01L 23/4951 (2013.01 - EP US); H01L 23/49537 (2013.01 - EP US); H01L 23/49541 (2013.01 - EP US); H01L 23/49544 (2013.01 - EP US); H01L 24/97 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 2224/05554 (2013.01 - EP US); H01L 2224/32014 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48247 (2013.01 - EP US); H01L 2224/4826 (2013.01 - EP US); H01L 2224/48465 (2013.01 - EP US); H01L 2224/73265 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01078 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/181 (2013.01 - EP US)

C-Set (source: EP US)

EP

  1. H01L 2224/48091 + H01L 2924/00014
  2. H01L 2924/00014 + H01L 2224/45099
  3. H01L 2924/00014 + H01L 2224/05599
  4. H01L 2924/181 + H01L 2924/00012
  5. H01L 2224/48465 + H01L 2224/48247 + H01L 2924/00
  6. H01L 2224/48465 + H01L 2224/4826 + H01L 2924/00
  7. H01L 2224/48465 + H01L 2224/48091 + H01L 2924/00

US

  1. H01L 2224/48091 + H01L 2924/00014
  2. H01L 2924/00014 + H01L 2224/45099
  3. H01L 2924/00014 + H01L 2224/05599
  4. H01L 2924/181 + H01L 2924/00012

Designated contracting state (EPC)

DE FR GB IT

DOCDB simple family (publication)

EP 0354696 A2 19900214; EP 0354696 A3 19910306; EP 0354696 B1 19961002; DE 68927285 D1 19961107; DE 68927285 T2 19970306; DE 68929251 D1 20001102; DE 68929251 T2 20010523; EP 0610971 A1 19940817; EP 0610971 B1 20000927; JP 2522524 B2 19960807; JP H0245969 A 19900215; KR 900004006 A 19900327; KR 920008254 B1 19920925; MY 105095 A 19940830; SG 47613 A1 19980417; SG 50702 A1 19980720; US 5198883 A 19930330

DOCDB simple family (application)

EP 89307740 A 19890731; DE 68927285 T 19890731; DE 68929251 T 19890731; EP 94106948 A 19890731; JP 19645388 A 19880806; KR 890011189 A 19890805; MY PI19891055 A 19890802; SG 1996003194 A 19890731; SG 1996009104 A 19890731; US 38184389 A 19890719