EP 0618584 B1 19981125 - Method and circuit for configuring I/O devices
Title (en)
Method and circuit for configuring I/O devices
Title (de)
Verfahren und Schaltung zum Konfigurieren von Eingang/Ausgangsanordnungen
Title (fr)
Méthode et circuit pour configurer des dispositifs d'entrée/de sortie
Publication
Application
Priority
US 3781893 A 19930326
Abstract (en)
[origin: EP0618584A1] A method and circuit for configuring I/O devices, such as a DRAM or other memory device, uses master-slave buffer circuits in configurable I/O devices. When arranged in a master-slave arrangement, the slave data buffer (23) is adapted to receive both input data (DI) and the output (EXTDI) of an associated master circuit (22). In one configuration, each data buffer outputs data (GDW) based upon the input data (DI). In another configuration, each slave buffer (23) outputs the output (EXTDI) of an associated master buffer (22). The circuit of the present invention is preferably employed with a configurable I/O device incorporated in a lead-on-chip (LOC) package, although could be used in any configurable I/O device. <IMAGE>
IPC 1-7
IPC 8 full level
H01L 21/82 (2006.01); G11C 7/10 (2006.01); G11C 11/401 (2006.01); G11C 11/409 (2006.01); H01L 21/822 (2006.01); H01L 21/8242 (2006.01); H01L 27/04 (2006.01); H01L 27/10 (2006.01); H01L 27/108 (2006.01); H03K 19/0175 (2006.01)
CPC (source: EP KR US)
G11C 7/1051 (2013.01 - EP KR US); G11C 7/1078 (2013.01 - EP KR US); G11C 7/1087 (2013.01 - EP KR US); G11C 7/1093 (2013.01 - EP US); G11C 11/4093 (2013.01 - KR); G11C 11/4096 (2013.01 - KR); G11C 7/1093 (2013.01 - KR); H01L 2224/05554 (2013.01 - EP US); H01L 2224/4826 (2013.01 - EP US)
Designated contracting state (EPC)
DE FR GB IT NL
DOCDB simple family (publication)
EP 0618584 A1 19941005; EP 0618584 B1 19981125; DE 69414744 D1 19990107; DE 69414744 T2 19990722; JP 3089247 B2 20000918; JP H06302697 A 19941028; KR 100294965 B1 20010917; KR 940020994 A 19941017; US 5373470 A 19941213
DOCDB simple family (application)
EP 94102694 A 19940223; DE 69414744 T 19940223; JP 8097794 A 19940328; KR 19940005619 A 19940321; US 3781893 A 19930326