EP 0620238 A3 19950125 - Epoxy resin composition.
Title (en)
Epoxy resin composition.
Title (de)
Epoxydharzzusammensetzung.
Title (fr)
Composition de résine époxyde.
Publication
Application
Priority
JP 12646993 A 19930416
Abstract (en)
[origin: EP0620238A2] An epoxy resin composition comprising an epoxy resin component containing at least 5% by weight of an epoxy resin of Formula [I], an epoxy hardener, and an inorganic filler as essential constituents: <CHEM> [wherein R and R<1> denote alkyl of C2 to C6, and n is an integer repetition unit from 0 to 10.]. The epoxy resin composition, when used as a molding material, is low in water absorption rate and flexural modulus (low stress).
IPC 1-7
IPC 8 full level
C07D 303/24 (2006.01); C08G 59/20 (2006.01); C08G 59/24 (2006.01); C08G 59/38 (2006.01); C08L 63/00 (2006.01)
CPC (source: EP US)
C07D 303/24 (2013.01 - EP US); C08G 59/245 (2013.01 - EP US); C08G 59/38 (2013.01 - EP US)
Citation (search report)
- [XY] US 4220513 A 19800902 - GREEN GEORGE E [GB], et al
- [Y] GB 1043410 A 19660921 - SHELL INT RESEARCH
- [X] CHEMICAL ABSTRACTS, vol. 116, no. 4, 27 January 1992, Columbus, Ohio, US; abstract no. 31572, "Thermal recording materials containing diglycidyl compound for good storage stability" & JP H03166983 A 19910718 - HONSHU PAPER CO LTD
- [A] DATABASE WPI Derwent World Patents Index; AN 90-310077
- [A] DATABASE WPI Derwent World Patents Index; AN 91-329227
- [A] DATABASE WPI Derwent World Patents Index; AN 90-316211
- [A] DATABASE WPI Derwent World Patents Index; AN 71-29531S
Designated contracting state (EPC)
CH DE GB LI NL
DOCDB simple family (publication)
EP 0620238 A2 19941019; EP 0620238 A3 19950125; EP 0620238 B1 19990303; DE 69416706 D1 19990408; DE 69416706 T2 19990819; JP H06298902 A 19941025; US 5494950 A 19960227
DOCDB simple family (application)
EP 94105563 A 19940411; DE 69416706 T 19940411; JP 12646993 A 19930416; US 22368094 A 19940406