EP 0624801 A1 19941117 - Inspection apparatus, inspection method and semiconductor device.
Title (en)
Inspection apparatus, inspection method and semiconductor device.
Title (de)
Inspektionsapparat und -Verfahren, sowie Halbleiter.
Title (fr)
Appareil d'inspection, méthode d'inspection et dispositif semi-conducteur.
Publication
Application
Priority
JP 8356693 A 19930409
Abstract (en)
There are disposed (i) a signal transmission passage extending, on the top surface of a ceramic supporting substrate, from one end to the other end thereof, (ii) a grounding electrode on the entire top surface of the supporting substrate except for its portion where the signal transmission passage is disposed and for its portion adjacent to the first-mentioned portion, and (iii) a detecting electrode at the underside of the one end of the supporting substrate. A microstrip line is formed by the signal transmission passage and those portions of the grounding electrode which are opposite to each other with the signal transmission passage held therebetween. Each of the grounding electrode, the signal transmission passage and the detecting electrode is made of an alloy containing 90 % or more of gold. The signal transmission passage and the detecting electrode are electrically connected to each other by an alloy of the type above-mentioned through a through-hole formed in the supporting substrate at the one end thereof. <IMAGE>
IPC 1-7
IPC 8 full level
G01R 1/067 (2006.01); G01R 31/26 (2006.01); H01L 21/66 (2006.01)
CPC (source: EP)
G01R 1/06772 (2013.01)
Citation (search report)
- [Y] US 4894612 A 19900116 - DRAKE ROBERT E [US], et al
- [Y] GB 2197081 A 19880511 - PLESSEY CO PLC
- [A] US 4983910 A 19910108 - MAJIDI-AHY GHOLAMREZA [US], et al
Designated contracting state (EPC)
DE GB
DOCDB simple family (publication)
DOCDB simple family (application)
EP 94105335 A 19940406; JP 8356693 A 19930409